Tan, Hwee Mian Jane
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5

Fan-Out Wafer-Level Packaging for Heterogeneous Integration:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Li, Zhang ; Tan, Kim Hwee... - p. 2360-2366 , 2018
 
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6

Reliability of Fan-Out Wafer-Level Packaging with Large Chi..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Kuah, Eric ; Li, Zhang... - p. 1574-1582 , 2018
 
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7

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous ..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Ko, Cheng-Ta ; Chang, Chieh-Lin ; Pan, Jhih-Yuan... - p. 355-363 , 2018
 
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9

SG-APSIC1180: Successful reduction in the number of hospita..:

Koduri, Sreekanth ; Yen, Tan Seow ; Thirukonda, Prasanna...
Antimicrobial Stewardship & Healthcare Epidemiology.  3 (2023)  S1 - p. s20-s21 , 2023
 
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