Tan, Kim Hwee
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1

Reliability of Fan-Out Wafer-Level Packaging with Large Chi..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Kuah, Eric ; Li, Zhang... - p. 1574-1582 , 2018
 
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2

Warpage Measurements and Characterizations of Fan-Out Wafer..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Kai, Wu ; Fan, Nelson... - p. 594-600 , 2018
 
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3

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous ..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Ko, Cheng-Ta ; Chang, Chieh-Lin ; Pan, Jhih-Yuan... - p. 355-363 , 2018
 
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4

Fan-Out Wafer-Level Packaging for Heterogeneous Integration:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Li, Zhang ; Tan, Kim Hwee... - p. 2360-2366 , 2018
 
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