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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Effect of Package Singulation Parameters on Dual Flat Non-l..:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
2
Adhesion and Reliability Study of Different EMC and Pre-pla..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
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Challenges & Solutions of Cu Wire Bonding on DFN Package wi..:
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2020 IEEE Symposium on Industrial Electronics & Applications (ISIEA) ,
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