Tan, Shwu Miin
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1

Effect of Package Singulation Parameters on Dual Flat Non-l..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Wu, Siying ; Tan, Shwu Miin ; Xue, Jianlu.. - p. 1-4 , 2022
 
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2

Adhesion and Reliability Study of Different EMC and Pre-pla..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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3

Challenges & Solutions of Cu Wire Bonding on DFN Package wi..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
 
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4

Effects of FeOx, CoOx, and NiO catalysts and calcination te..:

Tan, Shwu-Miin ; Chai, Siang-Piao ; Liu, Wei-Wen.
Journal of Alloys and Compounds.  477 (2009)  1-2 - p. 785-788 , 2009
 
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6

Finite Element Analysis on Tibia with Osteogenesis Imperfec..:

, In: 2020 IEEE Symposium on Industrial Electronics & Applications (ISIEA),
 
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10

Patient Perceptions of Empowerment Processes, Health Outcom..:

Chen, Mei-Fang ; Tsai, Chung-Ting ; Hsu, Shwu-Miin...
Journal of Community Health Nursing.  30 (2013)  4 - p. 201-215 , 2013
 
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