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Tang, Gongyue
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1

Two-Phase Liquid Cooling for High-Power Microelectronics vi..:

Feng, Huicheng ; Tang, Gongyue ; Zhang, Xiaowu...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  3 - p. 397-405 , 2024
Link: https://doi.org/10.1109/..
 
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2

Development of Real-Time Thermal Monitoring of GaN-based Po..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
He, Bin ; Saha, Jaydeep ; Bhujade, Rahul Sadanand.. - p. 478-485 , 2024
Link: https://doi.org/10.1109/..
 
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3

Embedded Liquid Cooling of High-Power Microelectronics Usin..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Feng, Huicheng ; He, Bin ; Tang, Gongyue... - p. 1569-1574 , 2024
Link: https://doi.org/10.1109/..
 
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4

Thermal Management of 6-in-1 SiC Power Module with Double-S..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Han, Yong ; Tang, Gongyue - p. 1493-1497 , 2024
Link: https://doi.org/10.1109/..
 
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5

Transient Thermal Characterization and Analysis for Next Ge..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Tang, Gongyue ; Ye, Yong Liang ; Ching Wai, Leong. - p. 244-248 , 2023
Link: https://doi.org/10.1109/..
 
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6

Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Coolin..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Feng, Huicheng ; Tang, Gongyue ; Zhang, Xiaowu... - p. 1964-1968 , 2023
Link: https://doi.org/10.1109/..
 
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7

Development of Crossflow Manifold for Two-Phase Liquid Cool..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Feng, Huicheng ; Tang, Gongyue ; Zhang, Xiaowu... - p. 1012-1016 , 2023
Link: https://doi.org/10.1109/..
 
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8

Double-side Liquid Cooling Development for 6-in-1 SiC Power..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Han, Yong ; Tang, Gongyue - p. 235-239 , 2023
Link: https://doi.org/10.1109/..
 
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9

Development and Demonstration of a Novel Immersion Two Phas..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Tang, Gongyue ; Wai, Leong Ching ; Feng, Huicheng - p. 1553-1558 , 2023
Link: https://doi.org/10.1109/..
 
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10

Thermal Characterization and Management of GaN-on-SiC High ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Han, Yong ; Tang, Gongyue ; Lau, Boon Long - p. 1989-1993 , 2023
Link: https://doi.org/10.1109/..
 
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11

Pressure-assist Silver Sintering Paste for SiC Power Device..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Wai, Leong Ching ; Yamamoto, Kazunori ; Tang, Gongyue. - p. 2211-2216 , 2022
Link: https://doi.org/10.1109/..
 
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12

Thermal modelling, characterization and optimization of 2.5..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chen, Haoran ; Lim, Teck Guan ; Tang, Gongyue - p. 941-944 , 2022
Link: https://doi.org/10.1109/..
 
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13

Thermal Challenges and Design Considerations in Heterogeneo..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chen, Haoran ; Lim, Teck Guan ; Tang, Gongyue - p. 1030-1035 , 2022
Link: https://doi.org/10.1109/..
 
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14

Development of Advanced Liquid Cooling Solution on Data Cen..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Zhang, Xiaowu ; Han, Yong ; Tang, Gongyue.. - p. 1680-1686 , 2022
Link: https://doi.org/10.1109/..
 
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15

Thermal Analysis and Test Condition Definition of Power cyc..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Tang, Gongyue - p. 930-934 , 2022
Link: https://doi.org/10.1109/..
 
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