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Packaging Challenges and Solutions for Next Generation Low-..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Tang, Humi Shih-Wen ; Li, Jerry Che-Han ; Huang, Leo Hsin-Hung... - p. 2083-2090 , 2024

Link: https://doi.org/10.1109/..

2

Ultra-thin Double Side SiP Technology with Embedded Trace S..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Li, Jerry Che-Han ; Belonio, Jesus Mennen ; Tang, Humi Shih-Wen. - p. 1277-1281 , 2024

Link: https://doi.org/10.1109/..

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