Search for persons
X
?
2024 International Conference on Electronics Packaging (ICEP) ,
1
Stability Study of Quantum Dot Color Converted Mini/Micro-L..:
, In:
?
2023 International Conference on Electronics Packaging (ICEP) ,
2
Quantum Dot Color Conversion Film with Enhanced Color Rende..:
, In:
?
2023 IEEE CPMT Symposium Japan (ICSJ) ,
3
Pillar-Cavity Copper-Copper Bonding for Face-to-Face Carbon..:
, In:
?
2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
5
Long-term Stability Evaluation of Thermal Interface Materia..:
, In:
?
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ,
6
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous ..:
, In:
?
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ,
7
Reliability of Fan-Out Wafer-Level Packaging with Large Chi..:
, In:
?
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ,
8
Fan-Out Wafer-Level Packaging for Heterogeneous Integration:
, In:
?
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ,
10