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Tee, Tong Yan
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1

Advanced analysis on board trace reliability of WLCSP under..:

Syed, Ahmer ; Tee, Tong Yan ; Ng, Hun Shen...
Microelectronics Reliability.  50 (2010)  7 - p. 928-936 , 2010
Link: https://doi.org/10.1016/..
 
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2

Advances in Wafer Level Packaging (WLP):

Tee, Tong Yan ; Fan, Xuejun ; Lai, Yi-Shao
Microelectronics Reliability.  50 (2010)  4 - p. 479-480 , 2010
Link: https://doi.org/10.1016/..
 
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3

Advanced Analysis of WLCSP Copper Interconnect Reliability ..:

, In: 2008 10th Electronics Packaging Technology Conference,
Tee, Tong Yan ; Long, Bin Tan ; Anderson, Rex... - p. None , 2008
Link: https://doi.org/10.1109/..
 
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4

Impact of Thermal, Moisture, and Mechanical Loading Conditi..:

Loo, Shane ; Zhang, Xueren ; Ng, Hun Shen..
Journal of Electronic Materials.  36 (2007)  2 - p. 110-116 , 2007
Link: https://doi.org/10.1007/..
 
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5

Dynamic responses and solder joint reliability under board ..:

Luan, Jing-en ; Tee, Tong Yan ; Pek, Eric..
Microelectronics Reliability.  47 (2007)  2-3 - p. 450-460 , 2007
Link: https://doi.org/10.1016/..
 
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6

Board level solder joint reliability analysis of stacked di..:

Tee, Tong Yan ; Ng, Hun Shen ; Zhong, Zhaowei
Microelectronics Reliability.  46 (2006)  12 - p. 2131-2138 , 2006
Link: https://doi.org/10.1016/..
 
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7

Numerical and experimental correlation of high temperature ..:

Zhang, Xueren ; Tee, Tong Yan
Thin Solid Films.  504 (2006)  1-2 - p. 355-361 , 2006
Link: https://doi.org/10.1016/..
 
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8

Impact life prediction modeling of TFBGA packages under boa..:

Tee, Tong Yan ; Ng, Hun Shen ; Lim, Chwee Teck..
Microelectronics Reliability.  44 (2004)  7 - p. 1131-1142 , 2004
Link: https://doi.org/10.1016/..
 
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9

Board level solder joint reliability analysis and optimizat..:

Tee, Tong Yan ; Zhong, Zhaowei
Microelectronics Reliability.  44 (2004)  12 - p. 1957-1965 , 2004
Link: https://doi.org/10.1016/..
 
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10

Integrated vapor pressure, hygroswelling, and thermo-mechan..:

Tee, Tong Yan ; Zhong, Zhaowei
Microelectronics Reliability.  44 (2004)  1 - p. 105-114 , 2004
Link: https://doi.org/10.1016/..
 
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11

Board level solder joint reliability modeling and testing o..:

Tee, Tong Yan ; Ng, Hun Shen ; Yap, Daniel..
Microelectronics Reliability.  43 (2003)  7 - p. 1117-1123 , 2003
Link: https://doi.org/10.1016/..
 
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12

Comprehensive board-level solder joint reliability modeling..:

Tee, Tong Yan ; Ng, Hun Shen ; Yap, Daniel.
Microelectronics Reliability.  43 (2003)  8 - p. 1329-1338 , 2003
Link: https://doi.org/10.1016/..
 
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13

Reliability assessment and hygroswelling modeling of FCBGA ..:

Tee, Tong Yan ; Kho, Chek Lim ; Yap, Daniel...
Microelectronics Reliability.  43 (2003)  5 - p. 741-749 , 2003
Link: https://doi.org/10.1016/..
 
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14

Telomere shortening induces aging-associated phenotypes in ..:

Harley, Jasmine ; Santosa, Munirah Mohamad ; Ng, Chong Yi...
Biogerontology.  25 (2023)  2 - p. 341-360 , 2023
Link: https://doi.org/10.1007/..
 
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15

Correction: Exploring transcriptional regulators Ref-1 and ..:

Gampala, Silpa ; Shah, Fenil ; Zhang, Chi...
British Journal of Cancer.  127 (2022)  7 - p. 1378-1379 , 2022
Link: https://doi.org/10.1038/..
 
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