Teranishi, Shunsuke
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1

In-Depth Analysis of Bonding Interface at Die Level Hybrid ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Yoshihara, Yuki ; Fuse, Junya ; Iwata, Tomoya... - p. 3-4 , 2024
 
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3

Inorganic Temporary Direct Bonding for Collective Die to Wa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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Cavity-Resonator-Integrated Guided-Mode-Resonance Mirrors f..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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8

Integrated-photonic device serving as both external laser m..:

, In: 2022 28th International Semiconductor Laser Conference (ISLC),
 
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9

Cavity-Resonator-Integrated Guided-Mode Resonance Mirror wi..:

, In: 2022 27th OptoElectronics and Communications Conference (OECC) and 2022 International Conference on Photonics in Switching and Computing (PSC),
 
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13

Combinatorial screening for therapeutics in ATTRv amyloidos..:

Sasaki, Ryoko ; Suico, Mary Ann ; Chosa, Keisuke...
Journal of Pharmacological Sciences.  151 (2023)  1 - p. 54-62 , 2023
 
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