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2024 International Conference on Electronics Packaging (ICEP) ,
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In-Depth Analysis of Bonding Interface at Die Level Hybrid ..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
3
Inorganic Temporary Direct Bonding for Collective Die to Wa..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
5
Cavity-Resonator-Integrated Guided-Mode-Resonance Mirrors f..:
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2022 IEEE CPMT Symposium Japan (ICSJ) ,
7
Demonstration of small-aperture cavity-resonator-integrated..:
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2022 28th International Semiconductor Laser Conference (ISLC) ,
8
Integrated-photonic device serving as both external laser m..:
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2022 27th OptoElectronics and Communications Conference (OECC) and 2022 International Conference on Photonics in Switching and Computing (PSC) ,
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