Tetsuo Fukuda
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1

The Analysis of Bending Stress and Mechanical Property of U..:

Tetsuo Fukuda, Tetsuo Fukuda
Japanese Journal of Applied Physics.  35 (1996)  7R - p. 3799 , 1996
 
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2

The Relationship between the Bending Stress in Silicon Wafe..:

Tetsuo Fukuda, Tetsuo Fukuda
Japanese Journal of Applied Physics.  34 (1995)  6R - p. 3209 , 1995
 
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4

Influence of tract location on the outcomes of endoscopic c..:

Tabei, Tadashi ; Ito, Hiroki ; Inoue, Takaaki...
International Journal of Urology.  31 (2023)  4 - p. 349-354 , 2023
 
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7

Advanced damage-free neutral beam etching technology to tex..:

Sekhar, Halubai ; Fukuda, Tetsuo ; Kubota, Tomohiro...
Journal of Materials Science: Materials in Electronics.  32 (2021)  23 - p. 27449-27461 , 2021
 
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8

The impact of silicon brick polishing on thin (120 μm) sili..:

Sekhar, Halubai ; Fukuda, Tetsuo ; Tanahashi, Katsuto.
Materials Science in Semiconductor Processing.  105 (2020)  - p. 104751 , 2020
 
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9

Mechanical strength problem of thin silicon wafers (120 and..:

Sekhar, Halubai ; Fukuda, Tetsuo ; Tanahashi, Katsuto...
Materials Science in Semiconductor Processing.  119 (2020)  - p. 105209 , 2020
 
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12

The impact of damage etching on fracture strength of diamon..:

Sekhar, Halubai ; Fukuda, Tetsuo ; Kida, Yasuhiro..
Japanese Journal of Applied Physics.  57 (2018)  12 - p. 126501 , 2018
 
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13

Evaluation of various cultivars of Actinidia species and br..:

Kisaki, Gan ; Tanaka, Sawa ; Ishihara, Ayumi...
Journal of General Plant Pathology.  84 (2018)  6 - p. 399-406 , 2018
 
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14

The impact of subsurface damage on the fracture strength of..:

Sekhar, Halubai ; Fukuda, Tetsuo ; Tanahashi, Katsuto...
Japanese Journal of Applied Physics.  57 (2018)  8S3 - p. 08RB08 , 2018
 
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15

The impact of saw mark direction on the fracture strength o..:

Sekhar, Halubai ; Fukuda, Tetsuo ; Tanahashi, Katsuto...
Japanese Journal of Applied Physics.  57 (2018)  9 - p. 095501 , 2018
 
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