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Thekkut, S.
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1

Enhanced voiding in Cu-Sn micro joints:

Njuki, M. ; Thekkut, S. ; Sivasubramony, R....
Materials Research Bulletin.  150 (2022)  - p. 111759 , 2022
Link: https://doi.org/10.1016/..
 
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2

Preventing Void Growth Between Ni3Sn4 and Solder:

Njuki, M. ; Thekkut, S. ; Das, R...
Journal of Electronic Materials.  51 (2022)  11 - p. 6333-6346 , 2022
Link: https://doi.org/10.1007/..
 
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3

Understanding and preventing Cu–Sn micro joint defects thro..:

Njuki, M. ; Thekkut, S. ; Das, R....
Journal of Applied Electrochemistry.  52 (2021)  2 - p. 259-271 , 2021
Link: https://doi.org/10.1007/..
 
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4

Damage Accumulation in Printed Interconnects on Flex Under ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Sivasubramony, R.S. ; Alhendi, M. ; Kokash, M.Z.... - p. 1225-1233 , 2020
Link: https://doi.org/10.1109/..
 
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5

Effect of Intermetallic Morphology Evolution on Void Format..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Thekkut, S. ; Das, R. ; Njuki, M.... - p. 485-491 , 2020
Link: https://doi.org/10.1109/..
 
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6

A mechanistic model of damage evolution in lead free solder..:

Borgesen, P. ; Wentlent, L. ; Alghoul, T....
Microelectronics Reliability.  95 (2019)  - p. 65-73 , 2019
Link: https://doi.org/10.1016/..
 
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