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Thielen, Nils
21  results:
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1

Comparative Study on Different Methods to Generate Syntheti..:

, In: 2024 1st International Conference on Production Technologies and Systems for E-Mobility (EPTS),
Thielen, Nils ; Rachinger, Ben ; Schroder, Felix... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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2

Influences on the Mechanical Strength of Inkjet-Printed, Ag..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
Voigt, Christian ; Dornheim, Johannes ; Muth, Alexander... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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3

Optimizing Machine Learning Performance via Dataset Generat..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Mahr, Felix ; Schmidt, Konstantin ; Thielen, Nils.. - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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4

Development and validation of a digital twin framework for ..:

Seidel, Reinhardt ; Rachinger, Ben ; Thielen, Nils...
Computers in Industry.  145 (2023)  - p. 103831 , 2023
Link: https://doi.org/10.1016/..
 
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5

A process model for systematically setting up the data basi..:

Meier, Sven ; Klarmann, Steffen ; Thielen, Nils...
Journal of Manufacturing Systems.  71 (2023)  - p. 1-19 , 2023
Link: https://doi.org/10.1016/..
 
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6

Analysis of the Suitability of Inkjet-Printed Ag-Particle-F..:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
Voigt, Christian ; Petersen, Matthias ; Thielen, Nils... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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7

Anomaly Detection for Dispensing of Solder Paste on 3D Circ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Thielen, Nils ; Wagner, Marco ; Meier, Sven.. - p. 932-937 , 2023
Link: https://doi.org/10.1109/..
 
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8

Machine Learning Based Quality Prediction for Solder Paste ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Thielen, Nils ; Pan, Wenzhe ; Piechulek, Niklas... - p. 858-863 , 2022
Link: https://doi.org/10.1109/..
 
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9

Attention-based Image Compression in Sensor Assembly:

, In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME),
Meier, Sven ; Erkan, Acelya ; Thielen, Nils.. - p. 136-141 , 2022
Link: https://doi.org/10.1109/..
 
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10

Multi-Model Machine Learning based Industrial Vision Framew..:

, In: 2022 IEEE 27th International Conference on Emerging Technologies and Factory Automation (ETFA),
Schwab, Maximilian ; Madeline-Derou, Charles ; Klarmann, Steffen... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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11

Trustworthiness of machine learning models in manufacturing..:

Seidel, Reinhardt ; Schmidt, Konstantin ; Thielen, Nils.
Procedia CIRP.  107 (2022)  - p. 487-492 , 2022
Link: https://doi.org/10.1016/..
 
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12

Prediction of the Solder Rise in Selective Wave Soldering C..:

, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE),
Seidel, Reinhardt ; Leibold, Fabian ; Thielen, Nils. - p. 1-7 , 2020
Link: https://doi.org/10.1109/..
 
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13

Experimental Investigation on Thermocouple Attachment Metho..:

, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE),
Seidel, Reinhardt ; Volland, Jana ; Thielen, Nils.. - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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14

Development and Test of a Data Framework for Prediction of ..:

, In: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME),
Seidel, Reinhardt ; Thielen, Nils ; Schmidt, Konstantin.. - p. 250-255 , 2020
Link: https://doi.org/10.1109/..
 
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15

A Machine Learning Based Approach to Detect False Calls in ..:

, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE),
Thielen, Nils ; Werner, Dominik ; Schmidt, Konstantin... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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