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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
4
Fine pitch Nb-Nb Direct Bonding for quantum applications:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
6
Integration of planarized Nb-based vias to form a multi-lev..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
8
Process Development and Characterization of Ru-based UBM fo..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
11
Characterizations of Indium Interconnects for 3D Quantum As..:
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ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC) ,
12