Thomas, Candice
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4

Fine pitch Nb-Nb Direct Bonding for quantum applications:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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6

Integration of planarized Nb-based vias to form a multi-lev..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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8

Process Development and Characterization of Ru-based UBM fo..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Tulzo, Harold Le ; Bijou, Diane ; Souza, Therese... - p. 378-385 , 2024
 
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11

Characterizations of Indium Interconnects for 3D Quantum As..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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12

A Cryogenic Active Router for Qubit Array Biasing from DC t..:

, In: ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC),
Jadot, Baptiste ; Zurita, Marcos ; Billiot, Gerard... - p. 157-160 , 2023
 
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