Tian, Ruyu
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1

Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder j..:

Tian, Ruyu ; Gao, Yan ; Wen, Jiayue...
Journal of Materials Research and Technology.  29 (2024)  - p. 5034-5047 , 2024
 
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Isothermal aging and electromigration reliability of Cu pil..:

Wang, Shuai ; Feng, Jiayun ; Wang, Wei...
Journal of Materials Research and Technology.  32 (2024)  - p. 937-954 , 2024
 
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In Situ-Polymerized PANI/WS2 Nanocomposites for Highly Sens..:

Feng, Zhao ; Wen, Jiayue ; Meng, Fanzhou...
ACS Applied Nano Materials.  7 (2024)  3 - p. 3385-3393 , 2024
 
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8

Effects of laser hybrid interfacial pretreatment on enhanci..:

Zou, Qi ; Jiao, Junke ; Xu, Jihao...
Materials Today Communications.  30 (2022)  - p. 103142 , 2022
 
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9

Ductile-brittle transition during tensile tests of the gene..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Guo, Xiaotong ; Xie, Fengjie ; Zuo, Xinlang... - p. 1-5 , 2022
 
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10

Effect of TIG remelting on microstructure, corrosion and we..:

Zhu, Lisong ; Cui, Yan ; Cao, Jinming...
Surface and Coatings Technology.  405 (2021)  - p. 126547 , 2021
 
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12

Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/EN..:

Tian, Ruyu ; Tian, Yanhong ; Huang, Yilong...
Journal of Materials Science: Materials in Electronics.  32 (2021)  6 - p. 6890-6899 , 2021
 
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13

Shear Properties and Fracture Behaviors of Cu/Sn-37Pb/Cu So..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Tian, Ruyu ; Wang, Chunlei ; Tian, Yanhong - p. 1-3 , 2021
 
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14

Influence of shielding gas on microstructure and mechanical..:

Xia, Hongbo ; Tan, Caiwang ; Tian, Ruyu...
Journal of Manufacturing Processes.  54 (2020)  - p. 347-358 , 2020
 
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