Tie Peng
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2

Universal analytical solution to the temperature rise of su..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Zhongzheng ; Bao, Tong ; Yu, Shijie... - p. 1-5 , 2020
 
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3

Investigation on heat transfer characteristics of R134a spr..:

Li, Qiang ; Tie, Peng ; Xuan, Yimin
Experimental Thermal and Fluid Science.  60 (2015)  - p. 182-187 , 2015
 
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4

Heat transfer performance of Cu–water nanofluids in the jet..:

Tie, Peng ; Li, Qiang ; Xuan, Yimin
International Journal of Thermal Sciences.  77 (2014)  - p. 199-205 , 2014
 
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5

The effect of surfactants on heat transfer feature of nanof..:

Xuan, Yimin ; Li, Qiang ; Tie, Peng
Experimental Thermal and Fluid Science.  46 (2013)  - p. 259-262 , 2013
 
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6

Investigation on the submerged liquid jet arrays impingemen..:

Tie, Peng ; Li, Qing ; Xuan, Yimin
Applied Thermal Engineering.  31 (2011)  14-15 - p. 2757-2763 , 2011
 
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8

Effect of Al content on modification behavior of non-metall..:

Tie, Zhan-peng ; Jiang, Xue-yuan ; Tang, Hai-yan...
Journal of Iron and Steel Research International.  31 (2024)  8 - p. 1886-1899 , 2024
 
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