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Tillocher, T.
43  results:
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1

Cryogenic etching of silicon compounds using a CHF3 based p..:

Dussart, R. ; Ettouri, R. ; Nos, J....
Journal of Applied Physics.  133 (2023)  11 - p. , 2023
Link: https://doi.org/10.1063/..
 
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2

Quasi In Situ XPS on a SiOxFy Layer Deposited on Silicon by..:

Antoun, G. ; Girard, A. ; Tillocher, T....
ECS Journal of Solid State Science and Technology.  11 (2022)  1 - p. 013013 , 2022
Link: https://doi.org/10.1149/..
 
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3

Author Correction: Mechanism understanding in cryo atomic l..:

Antoun, G. ; Tillocher, T. ; Lefaucheux, P....
Scientific Reports.  12 (2022)  1 - p. , 2022
Link: https://doi.org/10.1038/..
 
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4

Mechanism understanding in cryo atomic layer etching of SiO..:

Antoun, G. ; Tillocher, T. ; Lefaucheux, P....
Scientific Reports.  11 (2021)  1 - p. , 2021
Link: https://doi.org/10.1038/..
 
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5

The role of physisorption in the cryogenic etching process ..:

Antoun, G. ; Dussart, R. ; Tillocher, T....
Japanese Journal of Applied Physics.  58 (2019)  SE - p. SEEB03 , 2019
Link: https://doi.org/10.7567/..
 
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6

Cryo atomic layer etching of SiO2 by C4F8 physisorption fol..:

Antoun, G. ; Lefaucheux, P. ; Tillocher, T....
Applied Physics Letters.  115 (2019)  15 - p. , 2019
Link: https://doi.org/10.1063/..
 
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7

The effect of SF6addition in a Cl2/Ar inductively coupled p..:

Laudrel, E ; Tillocher, T ; Meric, Y...
Journal of Micromechanics and Microengineering.  28 (2018)  5 - p. 055010 , 2018
Link: https://doi.org/10.1088/..
 
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8

Damage-free plasma etching of porous organo-silicate low-k ..:

Chanson, R. ; Zhang, L. ; Naumov, S....
Scientific Reports.  8 (2018)  1 - p. , 2018
Link: https://doi.org/10.1038/..
 
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9

High aspect ratio etched sub-micron structures in silicon o..:

Kulsreshath, M. ; Vital, A. ; Lefaucheux, P....
Micro and Nano Engineering.  1 (2018)  - p. 42-48 , 2018
Link: https://doi.org/10.1016/..
 
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10

Parametric study of STiGer etching process in order to redu..:

Kafrouni, W. ; Tillocher, T. ; Ladroue, J....
Vacuum.  133 (2016)  - p. 90-97 , 2016
Link: https://doi.org/10.1016/..
 
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11

Modification of poly(styrene) thin films and enhancement of..:

Vital, A. ; Vayer, M. ; Sinturel, C....
Polymer.  76 (2015)  - p. 123-130 , 2015
Link: https://doi.org/10.1016/..
 
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12

Cryogenic etching processes applied to porous low-kmaterial..:

Leroy, F ; Zhang, L ; Tillocher, T...
Journal of Physics D: Applied Physics.  48 (2015)  43 - p. 435202 , 2015
Link: https://doi.org/10.1088/..
 
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13

Plasma cryogenic etching of silicon: from the early days to..:

Dussart, R ; Tillocher, T ; Lefaucheux, P.
Journal of Physics D: Applied Physics.  47 (2014)  12 - p. 123001 , 2014
Link: https://doi.org/10.1088/..
 
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14

Alternated process for the deep etching of titanium:

Tillocher, T ; Lefaucheux, P ; Boutaud, B.
Journal of Micromechanics and Microengineering.  24 (2014)  7 - p. 075021 , 2014
Link: https://doi.org/10.1088/..
 
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15

A novel amorphization–etch alternating process for Si(1 0 0:

Mekkakia-Maaza, N ; Dussart, R ; Tillocher, T..
Journal of Micromechanics and Microengineering.  23 (2013)  4 - p. 045023 , 2013
Link: https://doi.org/10.1088/..
 
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