I agree that this site is using cookies. You can find further informations here.
X
Tokei, Zsolt
120  results:
Search for persons X
?
1

Properties of Nbx Ti(1−x)N thin films deposited on 300 mm s..:

Lozano, Daniel Pérez ; Soulié, Jean-Philippe ; Hodges, Blake...
Superconductor Science and Technology.  37 (2024)  7 - p. 075012 , 2024
Link: https://doi.org/10.1088/..
 
?
2

Al3Sc thin films for advanced interconnect applications:

Soulié, Jean-Philippe ; Sankaran, Kiroubanand ; Founta, Valeria...
Microelectronic Engineering.  286 (2024)  - p. 112141 , 2024
Link: https://doi.org/10.1016/..
 
?
3

Selectivity and Growth Rate Modulations for Ruthenium Area‐..:

Mandal, Akhilesh Kumar ; van der Veen, Marleen H. ; Rahnemai Haghighi, Negin...
Advanced Materials Technologies.  9 (2024)  5 - p. , 2024
Link: https://doi.org/10.1002/..
 
?
4

Experimentally Validated Thermal Modeling Prediction for BE..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chang, Xinyue ; Oprins, Herman ; Vermeersch, Bjorn... - p. 498-505 , 2024
Link: https://doi.org/10.1109/..
 
?
5

Microsecond UV laser annealing annihilating Ru grains small..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Lu, Lu ; Jourdan, Nicolas ; Daubriac, Richard... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
?
6

Ru Stress Assessment by Membrane Wrinkling for Interconnect..:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Founta, Valeria ; Soulie, Jean-Philippe ; De Wolf, Ingrid... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
?
7

Towards accurate temperature prediction in BEOL for reliabi..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Lofrano, Melina ; Oprins, Herman ; Chang, Xinyue... - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
?
8

Electromigration-aware design technology co-optimization fo..:

, In: 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE),
Mayahinia, Mahta ; Liu, Hsiao-Hsuan ; Mishra, Subrat... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
?
9

Reduced resistivity of NiAl by backthinning for advanced in..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Soulie, Jean-Philippe ; Tokei, Zsolt ; Heylen, Nancy. - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
?
10

Graphene-Based Interconnect Exploration for Large SRAM Cach..:

Pei, Zhenlin ; Mayahinia, Mahta ; Liu, Hsiao-Hsuan...
IEEE Transactions on Electron Devices.  70 (2023)  1 - p. 230-238 , 2023
Link: https://doi.org/10.1109/..
 
?
11

Intermetallic Compounds as Alternatives to Copper for Advan..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Adelmann, Christoph ; Soulie, Jean-Philippe ; Scheerder, Jeroen E.... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
?
12

Emerging Interconnect Exploration for SRAM Application Usin..:

, In: 2023 24th International Symposium on Quality Electronic Design (ISQED),
Pei, Zhenlin ; Mayahinia, Mahta ; Liu, Hsiao-Hsuan... - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
?
13

Towards Enabling Two Metal Level Semi-Damascene Interconnec..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Pokhrel, Ankit ; Gupta, Anshul ; Kim, Min-Soo... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
?
14

Two-metal-level semi-damascene interconnect at metal pitch ..:

, In: 2023 International Electron Devices Meeting (IEDM),
Gupta, Anshul ; Marti, Giulio ; Delie, Gilles... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
?
15

Calibrated fast thermal calculation and experimental charac..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Chang, Xinyue ; Oprins, Herman ; Lofrano, Melina... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
1-15