Tomatsu, Itsuro
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1

Wet Cu passivation for high throughput fluxless Thermal Com..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Rip, Jens ; Derakhshandeh, Jaber ; Negishi, Ryo... - p. 1859-1862 , 2024
 
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2

Selective Cu Surface Activation for Cu-Sn Thermocompression..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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Selective Cu Surface Activation for Cu-Sn Thermocompression..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
 
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7

Photoresponsive hydrogels for biomedical applications:

Tomatsu, Itsuro ; Peng, Ke ; Kros, Alexander
Advanced Drug Delivery Reviews.  63 (2011)  14-15 - p. 1257-1266 , 2011
 
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13

Shape and Release Control of a Peptide Decorated Vesicle th..:

Versluis, Frank ; Tomatsu, Itsuro ; Kehr, Seda...
Journal of the American Chemical Society.  131 (2009)  37 - p. 13186-13187 , 2009
 
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14

Thermotropic Phase Behavior of Trialkyl Cyclohexanetriamide:

Tomatsu, Itsuro ; Fitié, Carel F. C. ; Byelov, Dmytro...
The Journal of Physical Chemistry B.  113 (2009)  43 - p. 14158-14164 , 2009
 
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15

Photo-Polymerization of AmphiphilicN,O-diacylated Serine-Ba..:

Tomatsu, Itsuro ; Hashidzume, Akihito ; Harada, Akira
Macromolecular Chemistry and Physics.  210 (2009)  19 - p. 1640-1646 , 2009
 
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