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2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Case Study For STI-LDNMOS Burned During HCI Stress to Passi..:
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2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) ,
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Electrical failure analysis using SEM Automated Process Ins..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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EMMI Abnormal Hotspot Study for Latch up Simulation:
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2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE) ,
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Design of Semi-Automatic Annotation for Visual Recognition ..:
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2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE) ,
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Design an Automatic Posture Discrimination System for Opera..:
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2022 IEEE 4th Eurasia Conference on IOT, Communication and Engineering (ECICE) ,
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Develop an Intelligent Robotic Arm Grasp and Control System..:
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2022 IEEE 4th Eurasia Conference on IOT, Communication and Engineering (ECICE) ,
12