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Tsai, Chun-Pu
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1

TCF-Tailoring Vertically Stepped Structures for Temperature..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Lan, Kai-Wei ; Chung, I-Fei ; Tsai, Chun-Pu.. - p. 140-143 , 2024
Link: https://doi.org/10.1109/..
 
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2

Toward High-Bit-Rate CMOS-MEMS Resoswitches:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Lee, Cheng-Ming ; Liou, Ting-Jui ; Tsai, Chun-Pu.. - p. 178-181 , 2024
Link: https://doi.org/10.1109/..
 
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3

Generic Temperature Compensation Scheme for CMOS-MEMS Reson..:

, In: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS),
Hsieh, I-Chieh ; Zheng, Hong-Sen ; Tsai, Chun-Pu.. - p. 1155-1158 , 2023
Link: https://doi.org/10.1109/..
 
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4

Micromechanical vibro-impact systems: a review:

Tsai, Chun-Pu ; Li, Wei-Chang
Journal of Micromechanics and Microengineering.  33 (2023)  9 - p. 093001 , 2023
Link: https://doi.org/10.1088/..
 
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5

Towards a Better CMOS-MEMS Resoswitch Using Electroless Pla..:

, In: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS),
Liou, Ting-Jui ; Tsai, Chun-Pu ; Chen, Ting-Yi. - p. 1206-1209 , 2023
Link: https://doi.org/10.1109/..
 
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6

A CMOS-MEMS Ultrasensitive Thermometer Using Internal Reson..:

, In: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS),
Chen, Ting-Yi ; Tsai, Chun-Pu ; Li, Wei-Chang - p. 185-188 , 2023
Link: https://doi.org/10.1109/..
 
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7

Micromechanical RSSI Based on Force Interaction Derived Tap..:

, In: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS),
Huang, Yi-Hsuan ; Zheng, Hong-Sen ; Tsai, Chun-Pu. - p. 487-490 , 2023
Link: https://doi.org/10.1109/..
 
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8

Attractor Exchanger for Open-Loop Operation of Micromechani..:

, In: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS),
Tsai, Chun-Pu ; Li, Wei-Chang - p. 181-184 , 2023
Link: https://doi.org/10.1109/..
 
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9

CMOS-MEMS Vibro-Impact Devices and Applications:

Tsai, Chun-Pu ; Li, Wei-Chang
Frontiers in Mechanical Engineering.  8 (2022)  - p. , 2022
Link: https://doi.org/10.3389/..
 
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10

Experimental Study on Frequency Stability of Micromechanica..:

, In: 2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF),
Tsai, Chun-Pu ; Liu, Jia-Ren ; Li, Wei-Chang - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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11

A 125-KHZ CMOS-MEMS Resoswitch Embedded Zero Quiescent Powe..:

, In: 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS),
Tsai, Chun-Pu ; Liao, Yen-Yu ; Li, Wei-Chang - p. 106-109 , 2020
Link: https://doi.org/10.1109/..
 
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12

Surface Condition Influence on the Nonlinear Response of ME..:

Lu, Shih-Chuan ; Tsai, Chun-Pu ; Huang, Yi-Chen..
IEEE Electron Device Letters.  , 2018
Link: https://doi.org/10.1109/..
 
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13

A CMOS-MEMS clamped–clamped beam displacement amplifier for..:

Liu, Jia-Ren ; Lu, Shih-Chuan ; Tsai, Chun-Pu.
Journal of Micromechanics and Microengineering.  28 (2018)  6 - p. 065001 , 2018
Link: https://doi.org/10.1088/..
 
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14

Single-grain Sn-rich micro-bump by reducing Sn undercooling..:

Tsai, Chieh-Pu ; Chiu, Chung-Yu ; Huang, Wei-Chieh...
Materials Letters.  357 (2024)  - p. 135729 , 2024
Link: https://doi.org/10.1016/..
 
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15

Low-temperature PECVD silicon-nitride passivation for perov..:

Lai, Tse-Lin ; Lee, Yun-Fong ; Hsu, Ya-Hui...
Materials Chemistry and Physics.  294 (2023)  - p. 126880 , 2023
Link: https://doi.org/10.1016/..
 
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