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Tsai, Hsing-Ying
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1

Mechanochromism of dynamic disulfide bonds as a chromophori..:

Tsai, Hsing-Ying ; Nakamura, Yasuyuki ; Hu, Wei-Hsun..
Materials Advances.  2 (2021)  15 - p. 5047-5051 , 2021
Link: https://doi.org/10.1039/..
 
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2

Environmentally friendly recycling system for epoxy resin w..:

Tsai, Hsing-Ying ; Fujita, Takehiro ; Wang, Siqian.
Science and Technology of Advanced Materials.  22 (2021)  1 - p. 532-542 , 2021
Link: https://doi.org/10.1080/..
 
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3

Strengthening epoxy adhesives at elevated temperatures base..:

Tsai, Hsing-Ying ; Nakamura, Yasuyuki ; Fujita, Takehiro.
Materials Advances.  1 (2020)  9 - p. 3182-3188 , 2020
Link: https://doi.org/10.1039/..
 
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4

Study on epoxy resin with dynamic covalent bonding for envi..:

Tsai, Hsing-Ying
甲第9797号.  , 2021
Link: https://tsukuba.repo.nii..
 
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5

Study on epoxy resin with dynamic covalent bonding for envi..:

Tsai, Hsing-Ying
甲第9797号.  , 2021
Link: https://tsukuba.repo.nii..
 
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6

Adipocyte pyroptosis occurs in omental tumor microenvironme..:

Lin, Chang-Ni ; Liang, Yu-Ling ; Tsai, Hsing-Fen...
Journal of Biomedical Science.  31 (2024)  1 - p. , 2024
Link: https://doi.org/10.1186/..
 
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7

Mitochondrial injury induced by a Salmonella genotoxin trig..:

Chen, Han-Yi ; Hsieh, Wan-Chen ; Liu, Yu-Chieh...
Nature Communications.  15 (2024)  1 - p. , 2024
Link: https://doi.org/10.1038/..
 
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8

8.11 A 48V-to-5V Buck Converter with Triple EMI Suppression..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Kao, Yi-Hsiang ; Hung, Chieh-Sheng ; Chang, Hui-Hsuan... - p. 164-166 , 2024
Link: https://doi.org/10.1109/..
 
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9

31.2 A Ripple-Less Buck Converter with Sub -21.94dB EVM for..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Kao, Yi-Hsiang ; Wu, Jie-Lin ; Huang, Wei-Cheng... - p. 498-500 , 2024
Link: https://doi.org/10.1109/..
 
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10

A GaN-on-Si Gate Driver With Self-Pumped Drive Enhance and ..:

Tsai, Hsing-Yen ; Chen, Ke-Horng ; Zheng, Kuo-Lin...
IEEE Journal of Solid-State Circuits.  59 (2024)  3 - p. 784-793 , 2024
Link: https://doi.org/10.1109/..
 
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11

A 33V to 1V Ripple-Less Buck Converter With the Inverted AC..:

Kao, Yi-Hsiang ; Wu, Jie-Lin ; Liao, Chih-Cherng...
IEEE Solid-State Circuits Letters.  7 (2024)  - p. 183-186 , 2024
Link: https://doi.org/10.1109/..
 
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12

3-D Wireless Power Transfer With Noise Cancellation Techniq..:

Tsai, Hsing-Yen ; Huang, Fei ; Huang, Chi-Yu...
IEEE Solid-State Circuits Letters.  6 (2023)  - p. 213-216 , 2023
Link: https://doi.org/10.1109/..
 
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13

A 26nA Ultra-Low Input Current, 81nW Ultra-Low Power and 1μ..:

, In: ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC),
Lee, Sheng Cheng ; Liang, Yu-Teng ; Tsai, Hsing-Yen... - p. 317-320 , 2023
Link: https://doi.org/10.1109/..
 
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14

30.8 3D Wireless Power Transfer with Noise Cancellation Tec..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Huang, Fei ; Tsai, Hsing-Yen ; Huang, Chi-Yu... - p. 452-454 , 2023
Link: https://doi.org/10.1109/..
 
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15

A GaN-on-Si Gate Driver with 14.7X Reduction in Tailing Cur..:

, In: 2023 IEEE Custom Integrated Circuits Conference (CICC),
Tsai, Hsing-Yen ; Zheng, Kuo-Lin ; Chen, Ke-Horng... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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