Tsai, Mike
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1

MTIA: First Generation Silicon Targeting Meta's Recommendat..:

, In: Proceedings of the 50th Annual International Symposium on Computer Architecture,
 
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2

Reliable Study For Fine Line RDL Fan Out Multi Chip Module:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, Jolin ; Tsai, Mike ; Liu, Bradley... - p. 01-04 , 2023
 
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3

Difference Frequency of EMI Shielding Solutions for SiP Mod..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Tsai, Mike ; Chiu, Ryan ; Lin, James... - p. 211-214 , 2023
 
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4

Design of Single Miniaturized Dielectric Resonant Antenna f..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lai, Chia-Chu ; Lin, Sam ; Shih, Teny... - p. 1820-1824 , 2023
 
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5

Double Side SiP of Structure Strength Analysis for 5G and W..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Tsai, Mike ; Li, Wynn ; Ding, Ethan... - p. 18-23 , 2022
 
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6

EMI Shielding Technology in 5G RF System in Package Module:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Li, Jay ; Tsai, Mike ; Chiu, Ryan... - p. 931-937 , 2020
 
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7

Advanced Antenna Integration of 3D System in Package Soluti..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Tsai, Mike ; Chiu, Ryan ; He, Eric... - p. 1-6 , 2019
 
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8

Innovative EMI Shielding Solutions on Advanced SiP Module f..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Tsai, Mike ; Chiu, Ryan ; He, Eric... - p. 601-607 , 2019
 
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9

EMI Shielding Solutions for RF SiP Assembly:

, In: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Su, James PoYuan ; Wang, Yu Po ; Tsai, Mike. - p. 46-50 , 2019
 
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10

Flip Chip Assembly on Coreless Substrate Challenge with Die..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Su, James ; Wang, Yu Po ; Tsai, Mike.. - p. 1-5 , 2019
 
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11

Employing transport layer multi-railing in cluster networks:

Penoff, Brad ; Kamal, Humaira ; Wagner, Alan...
Journal of Parallel and Distributed Computing.  70 (2010)  3 - p. 259-269 , 2010
 
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12

Ginkgo: A Modern Linear Operator Algebra Framework for High..:

Anzt, Hartwig ; Cojean, Terry ; Flegar, Goran...
ACM Transactions on Mathematical Software (TOMS).  48 (2022)  1 - p. 1-33 , 2022
 
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13

Ginkgo: A Modern Linear Operator Algebra Framework for High..:

Anzt, Hartwig ; Cojean, Terry ; Flegar, Goran...
ACM Transactions on Mathematical Software.  48 (2022)  1 - p. 1-33 , 2022
 
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14

Three-precision algebraic multigrid on GPUs:

Tsai, Yu-Hsiang Mike ; Beams, Natalie ; Anzt, Hartwig
Future Generation Computer Systems.  149 (2023)  - p. 280-293 , 2023
 
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15

Mixed Precision Algebraic Multigrid on GPUs:

, In: Parallel Processing and Applied Mathematics; Lecture Notes in Computer Science,
 
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