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Proceedings of the 50th Annual International Symposium on Computer Architecture ,
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MTIA: First Generation Silicon Targeting Meta's Recommendat..:
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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Reliable Study For Fine Line RDL Fan Out Multi Chip Module:
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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Difference Frequency of EMI Shielding Solutions for SiP Mod..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Design of Single Miniaturized Dielectric Resonant Antenna f..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Double Side SiP of Structure Strength Analysis for 5G and W..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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EMI Shielding Technology in 5G RF System in Package Module:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Advanced Antenna Integration of 3D System in Package Soluti..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
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Innovative EMI Shielding Solutions on Advanced SiP Module f..:
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2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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EMI Shielding Solutions for RF SiP Assembly:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Flip Chip Assembly on Coreless Substrate Challenge with Die..:
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Parallel Processing and Applied Mathematics; Lecture Notes in Computer Science ,
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