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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Void Migration Kinetics in Fine Line Cu RDL under Electric ..:
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2024 International Conference on Electronics Packaging (ICEP) ,
3
Direct Observation of Void Nucleation and Growth in a 2-µm-..:
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Bio-inspired Information and Communications Technologies; Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering ,
7
Genetic Algorithm-Based Fair Order Assignment Optimization ..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
8
An Electromigration Study of Cu Pillar Interconnects in Fli..:
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Bio-inspired Information and Communication Technologies; Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering ,
11