Tsai, Min-Yan
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1

Void Migration Kinetics in Fine Line Cu RDL under Electric ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Huang, Yen-Cheng ; Tsai, Min-Yan ; Lin, Ting-Chun... - p. 576-580 , 2024
 
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3

Direct Observation of Void Nucleation and Growth in a 2-µm-..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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5

Microstructure and growth of Cu hillock on redistribution l..:

Huang, Yen-Cheng ; Tsai, Min-Yan ; Lin, Ting-Chun...
Journal of Materials Science: Materials in Electronics.  35 (2024)  9 - p. , 2024
 
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7

Genetic Algorithm-Based Fair Order Assignment Optimization ..:

, In: Bio-inspired Information and Communications Technologies; Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering,
Tsai, Min-Yan ; Lin, Guo-Yu ; Zeng, Jiang-Yi... - p. 122-132 , 2023
 
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8

An Electromigration Study of Cu Pillar Interconnects in Fli..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Tsai, Min-Yan ; Kao, Chin-Li ; Wang, Shan-Bo... - p. 326-332 , 2023
 
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9

Improving Randomness of Symmetric Encryption for Consumer P..:

Cho, Hsin-Hung ; Tsai, Min-Yan ; Tseng, Fan-Hsun..
IEEE Consumer Electronics Magazine.  11 (2022)  1 - p. 42-49 , 2022
 
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10

A High Security Symmetric Key Generation by Using Genetic A..:

Tsai, Min-Yan ; Cho, Hsin-Hung
Mobile Networks and Applications.  26 (2021)  3 - p. 1386-1396 , 2021
 
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11

A Novel Genetic Algorithm-Based DES Key Generation Scheme:

, In: Bio-inspired Information and Communication Technologies; Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering,
Tsai, Min-Yan ; Cho, Hsin-Hung ; Chen, Chi-Yuan. - p. 199-211 , 2020
 
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14

Efficient Method for Frozen Bits Encoding and Decoding of P..:

Chen, Yan-Haw ; Tsai, Min-Yen ; Wang, J.J...
Journal of Physics: Conference Series.  1060 (2018)  - p. 012022 , 2018
 
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