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Tseng, Chien-Fu
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1

Effects of handheld nonthermal plasma on the biological res..:

Tseng, Chien-Fu ; Lee, I-Ta ; Wu, Sheng-Han...
Journal of Dental Sciences.  , 2024
Link: https://doi.org/10.1016/..
 
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2

Court decisions in criminal proceedings for dental malpract..:

Wu, King-Jean ; Chen, Yi-Wen ; Chou, Chu-Chun...
Journal of the Formosan Medical Association.  121 (2022)  5 - p. 903-911 , 2022
Link: https://doi.org/10.1016/..
 
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3

Association between Periodontal Disease and Subsequent Sjög..:

Lin, Chien-Yu ; Tseng, Chien-Fu ; Liu, Jui-Ming...
International Journal of Environmental Research and Public Health.  16 (2019)  5 - p. 771 , 2019
Link: https://doi.org/10.3390/..
 
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4

Reliability and validity of DS-ADHD: A decision support sys..:

Chu, Kuo-Chung ; Huang, Yu-Shu ; Tseng, Chien-Fu...
Computer Methods and Programs in Biomedicine.  140 (2017)  - p. 241-248 , 2017
Link: https://doi.org/10.1016/..
 
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5

Transport phenomena and the effects of reactor geometry for..:

Tseng, Chien-Fu ; Tsai, Tsung-Yen ; Huang, Yen-Hsiu..
Journal of Crystal Growth.  432 (2015)  - p. 54-63 , 2015
Link: https://doi.org/10.1016/..
 
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6

Clinical effectiveness, toxicity, and failure patterns of h..:

Hsieh, Chen-Hsi ; Shueng, Pei-Wei ; Wang, Li-Ying...
OncoTargets and Therapy.  , 2014
Link: https://doi.org/10.2147/..
 
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7

Predicting the Severity and Prognosis of Trismus after Inte..:

Hsieh, Li-Chun ; Chen, John W. ; Wang, Li-Ying...
PLoS ONE.  9 (2014)  3 - p. e92561 , 2014
Link: https://doi.org/10.1371/..
 
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8

Crystallographic characterization and growth behavior of (C..:

Tseng, Chien-Fu ; Ho, Cheng-Ying ; Lee, Joseph.
Journal of Alloys and Compounds.  600 (2014)  - p. 21-28 , 2014
Link: https://doi.org/10.1016/..
 
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9

Correlation between microstructure evolution and mechanical..:

Tseng, Chien-Fu ; Duh, Jenq-Gong
Materials Science and Engineering: A.  580 (2013)  - p. 169-174 , 2013
Link: https://doi.org/10.1016/..
 
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10

Roles of Cu in Pb-free solders jointed with electroless Ni(..:

Tseng, Chien-Fu ; Jill Lee, Christine ; Duh, Jenq-Gong
Materials Science and Engineering: A.  574 (2013)  - p. 60-67 , 2013
Link: https://doi.org/10.1016/..
 
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11

Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder join..:

Choi, Hyelim ; Lee, Tae-Kyu ; Kim, Yunsung...
Intermetallics.  20 (2012)  1 - p. 155-159 , 2012
Link: https://doi.org/10.1016/..
 
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12

The influence of Pd on growth behavior of a quaternary (Cu,..:

Tseng, Chien-Fu ; Duh, Jenq-Gong
Journal of Materials Science.  48 (2012)  2 - p. 857-865 , 2012
Link: https://doi.org/10.1007/..
 
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13

The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical S..:

Lee, Tae-Kyu ; Zhou, Bite ; Bieler, Thomas R...
Journal of Electronic Materials.  42 (2012)  2 - p. 215-223 , 2012
Link: https://doi.org/10.1007/..
 
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14

Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints ..:

Tseng, Chien-Fu ; Lee, Tae-Kyu ; Ramakrishna, Gnyaneshwar..
Materials Letters.  65 (2011)  21-22 - p. 3216-3218 , 2011
Link: https://doi.org/10.1016/..
 
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15

Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn U..:

Tseng, Chien-Fu ; Wang, Kai-Jheng ; Duh, Jenq-Gong
Journal of Electronic Materials.  39 (2010)  12 - p. 2522-2527 , 2010
Link: https://doi.org/10.1007/..
 
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