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Tseng, Wei-Tsu
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1

Contributors:

, In: Advances in Chemical Mechanical Planarization (CMP),
Aida, H. ; Baisie, E.A. ; Boning, D.... - p. xi-xiii , 2022
Link: https://doi.org/10.1016/..
 
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2

Approaches to defect characterization, mitigation and reduc..:

, In: Advances in Chemical Mechanical Planarization (CMP),
Tseng, Wei-Tsu - p. 467-503 , 2022
Link: https://doi.org/10.1016/..
 
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3

CMP Defect Reduction and Mitigation: Practices and Future T..:

, In: 2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Tseng, Wei-Tsu ; Boye, Carol ; Silvestre, Claire... - p. 1-6 , 2021
Link: https://doi.org/10.1109/..
 
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4

A Systematic Study on BEOL Defectivity Control for Future A..:

, In: 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chen, James H.-C. ; Lie, Fee li ; DeVries, Scott... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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5

Process Co-Optimization of CVD and CMP for Tungsten Metalli..:

Pancharatnam, Shanti ; Tseng, Wei-Tsu ; Choi, Samuel.
ECS Journal of Solid State Science and Technology.  9 (2020)  10 - p. 104004 , 2020
Link: https://doi.org/10.1149/..
 
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6

Application of a Slurry Injection System to Cobalt "Buff St..:

Stuffle, Calliandra ; Han, Ruochen ; Sampurno, Yasa...
ECS Journal of Solid State Science and Technology.  7 (2018)  4 - p. P170-P174 , 2018
Link: https://doi.org/10.1149/..
 
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7

Cobalt "Buff Step" Chemical Mechanical Planarization:

Stuffle, Calliandra ; Han, Ruochen ; Sampurno, Yasa...
ECS Journal of Solid State Science and Technology.  7 (2018)  3 - p. P114-P117 , 2018
Link: https://doi.org/10.1149/..
 
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8

Post Cleaning for FEOL CMP with Silica and Ceria Slurries:

Tseng, Wei-Tsu ; Jha, Amarnath ; Stoll, Derek...
ECS Transactions.  80 (2017)  2 - p. 91-99 , 2017
Link: https://doi.org/10.1149/..
 
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9

Post Cleaning for FEOL CMP with Silica and Ceria Slurries:

Tseng, Wei-Tsu ; Wu, Changhong ; McCormack, Tim.
ECS Journal of Solid State Science and Technology.  6 (2017)  10 - p. P718-P722 , 2017
Link: https://doi.org/10.1149/..
 
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10

CMP Challenges for Advanced Technology Nodes:

Zhang, John H. ; Huang, Haigou ; Greene, Andrew M....
MRS Advances.  2 (2017)  44 - p. 2361-2372 , 2017
Link: https://doi.org/10.1557/..
 
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11

A Combined Gas Cluster Ion Beam (GCIB) and Chemical-Mechani..:

Tseng, Wei-Tsu ; Long, Justin ; Mohan, Kaushik...
ECS Journal of Solid State Science and Technology.  5 (2016)  7 - p. P404-P408 , 2016
Link: https://doi.org/10.1149/..
 
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12

A Microreplicated Pad for Tungsten Chemical-Mechanical Plan..:

Tseng, Wei-Tsu ; Mohan, Kaushik ; Hull, Ricky...
ECS Journal of Solid State Science and Technology.  5 (2016)  9 - p. P546-P552 , 2016
Link: https://doi.org/10.1149/..
 
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13

Microreplicated Conditioners for Cu Barrier Chemical-Mechan..:

Tseng, Wei-Tsu ; Rafie, Sana ; Ticknor, Adam...
ECS Journal of Solid State Science and Technology.  4 (2015)  11 - p. P5001-P5007 , 2015
Link: https://doi.org/10.1149/..
 
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14

Post Cu CMP Cleaning of Polyurethane Pad Debris:

Tseng, Wei-Tsu ; Rill, Elliott ; Backes, Benjamin...
ECS Journal of Solid State Science and Technology.  3 (2013)  1 - p. N3023-N3031 , 2013
Link: https://doi.org/10.1149/..
 
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15

BEOL Cu CMP Process Evaluation for Advanced Technology Node:

Tanwar, Kunaljeet ; Canaperi, Donald ; Lofaro, Michael...
Journal of The Electrochemical Society.  160 (2013)  12 - p. D3247-D3254 , 2013
Link: https://doi.org/10.1149/..
 
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