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Tutunjyan, Nina
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1

RIE dynamics for extreme wafer thinning applications:

Rassoul, Nouredine ; Jourdain, Anne ; Tutunjyan, Nina...
Microelectronic Engineering.  192 (2018)  - p. 30-37 , 2018
Link: https://doi.org/10.1016/..
 
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2

Etch process modules development and integration in 3D-SOC ..:

Tutunjyan, Nina ; Sardo, Stefano ; De Vos, Joeri...
Microelectronic Engineering.  196 (2018)  - p. 38-48 , 2018
Link: https://doi.org/10.1016/..
 
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3

Silicon Based System for Single-Nucleotide-Polymorphism Det..:

Majeed, Bivragh ; Jones, Ben ; Tezcan, Deniz S....
Japanese Journal of Applied Physics.  51 (2012)  4S - p. 04DL01 , 2012
Link: https://doi.org/10.1143/..
 
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4

Silicon Based System for Single-Nucleotide-Polymorphism Det..:

Majeed, Bivragh ; Jones, Ben ; Tezcan, Deniz S....
Japanese Journal of Applied Physics.  51 (2012)  4S - p. 04DL01 , 2012
Link: https://doi.org/10.7567/..
 
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5

Thin MEMS Packages Obtained by a Novel Collective Cap Trans..:

Phommahaxay, Alain ; Bogaerts, Lieve ; Naito, Yasuyuki...
Procedia Engineering.  25 (2011)  - p. 1505-1508 , 2011
Link: https://doi.org/10.1016/..
 
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