Uedono, Akira
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1

Exploring Bonding Mechanism of SiCN for Hybrid Bonding:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ebiko, Sodai ; Iacovo, Serena ; Chew, Soon-Aik... - p. 1953-1957 , 2024
 
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D2W Hybrid Bonding System Achieving High-Accuracy and High-..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Mihara, Kentaro ; Hare, Takashi ; Sakai, Hirofumi... - p. 420-426 , 2024
 
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7

Mg implantation in AlN layers on sapphire substrates:

Okumura, Hironori ; Uedono, Akira
Japanese Journal of Applied Physics.  62 (2023)  2 - p. 020901 , 2023
 
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8

Systematic Search for Stabilizing Dopants in ZrO₂ and HfO₂ ..:

Harashima, Yosuke ; Koga, Hiroaki ; Ni, Zeyuan...
IEEE Transactions on Semiconductor Manufacturing.  36 (2023)  4 - p. 543-546 , 2023
 
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9

Inorganic Temporary Direct Bonding for Collective Die to Wa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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10

Analysis of Zn diffusion in various crystallographic direct..:

Sierakowski, Kacper ; Jakiela, Rafal ; Jaroszynski, Piotr...
Materials Science in Semiconductor Processing.  167 (2023)  - p. 107808 , 2023
 
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