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Vähäkangas, J.
534
results:
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Online (534)
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E-Books (8)
Articles (Online) (276)
Bookchapter (Online) (20)
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1
Orienting spins in dually doped monolayer MoS2: from one-si..:
Vähäkangas, J.
;
Lantto, P.
;
Vaara, J.
..
Chemical Communications. 53 (2017) 39 - p. 5428-5431 , 2017
Link:
https://doi.org/10.1039/..
?
2
Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2...:
Nousiainen, O.
;
Kangasvieri, T.
;
Rautioaho, R.
.
Soldering & Surface Mount Technology. 23 (2011) 1 - p. 30-39 , 2011
Link:
https://doi.org/10.1108/..
?
3
Effect of ENIG deposition on the failure mechanisms of ther..:
Nousiainen, O.
;
Kangasvieri, T.
;
Kautio, K.
..
Soldering & Surface Mount Technology. 22 (2010) 3 - p. 22-35 , 2010
Link:
https://doi.org/10.1108/..
?
4
Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free com..:
Nousiainen, O.
;
Kangasvieri, T.
;
Rautioaho, R.
.
Soldering & Surface Mount Technology. 20 (2008) 3 - p. 11-17 , 2008
Link:
https://doi.org/10.1108/..
?
5
Low‐loss and broadband BGA package transition for LTCC‐SiP ..:
Kangasvieri, T.
;
Halme, J.
;
Vähäkangas, J.
.
Microwave and Optical Technology Letters. 50 (2008) 4 - p. 1036-1040 , 2008
Link:
https://doi.org/10.1002/..
?
6
Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu sph..:
Nousiainen, O.
;
Lehtiniemi, L.
;
Kangasvieri, T.
..
Microelectronics Reliability. 48 (2008) 4 - p. 622-630 , 2008
Link:
https://doi.org/10.1016/..
?
7
Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plas..:
NOUSIAINEN, O.
;
PUTAALA, J.
;
KANGASVIERI, T.
..
Journal of Electronic Materials. 36 (2007) 3 - p. 232-241 , 2007
Link:
https://doi.org/10.1007/..
?
8
Chip cooling with integrated carbon nanotube microfin archi..:
Kordás, K.
;
Tóth, G.
;
Moilanen, P.
...
Applied Physics Letters. 90 (2007) 12 - p. , 2007
Link:
https://doi.org/10.1063/..
?
9
Reliability and RF performance of BGA solder joints with pl..:
Kangasvieri, T.
;
Nousiainen, O.
;
Putaala, J.
..
Microelectronics Reliability. 46 (2006) 8 - p. 1335-1347 , 2006
Link:
https://doi.org/10.1016/..
?
10
Metallurgical reactions in composite 90Pb10Sn/lead-free sol..:
Nousiainen, O.
;
Putaala, J.
;
Kangasvieri, T.
..
Journal of Electronic Materials. 35 (2006) 10 - p. 1857-1865 , 2006
Link:
https://doi.org/10.1007/..
?
11
Laser soldering of flip-chips:
Kordás, K.
;
Pap, A.E.
;
Tóth, G.
...
Optics and Lasers in Engineering. 44 (2006) 2 - p. 112-121 , 2006
Link:
https://doi.org/10.1016/..
?
12
Miniaturized low‐loss Wilkinson power divider for RF front‐..:
Kangasvieri, T.
;
Hautajärvi, I.
;
Jantunen, H.
.
Microwave and Optical Technology Letters. 48 (2006) 4 - p. 660-663 , 2006
Link:
https://doi.org/10.1002/..
?
13
Thermal oxidation of porous silicon: Study on structure:
Pap, A. E.
;
Kordás, K.
;
Tóth, G.
...
Applied Physics Letters. 86 (2005) 4 - p. 041501 , 2005
Link:
https://doi.org/10.1063/..
?
14
Carbon nanotube synthesis on oxidized porous silicon:
Kordás, K.
;
Pap, A.E.
;
Vähäkangas, J.
..
Applied Surface Science. 252 (2005) 5 - p. 1471-1475 , 2005
Link:
https://doi.org/10.1016/..
?
15
Design aspects of microwave components with LTCC technique:
Jantunen, H.
;
Kangasvieri, T.
;
Vähäkangas, J.
.
Journal of the European Ceramic Society. 23 (2003) 14 - p. 2541-2548 , 2003
Link:
https://doi.org/10.1016/..
1-15