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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Impact of Pitch Scaling on 3D Die-to-Die Interconnects:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Block level and package level thermal assessment for back s..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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A 32 Gb/s Full duplex Bi-directional Transceiver with Cross..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Thermal and Mechanical characterization of embedded PTCQ pa..:
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2023 IEEE International 3D Systems Integration Conference (3DIC) ,
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Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch..:
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2023 45th Annual EOS/ESD Symposium (EOS/ESD) ,
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ESD process assessment of 2.5D and 3D bonding technologies:
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2023 Design, Automation & Test in Europe Conference & Exhibition (DATE) ,
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NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integr..:
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Proceedings of the 24th ACM/IEEE Workshop on System Level Interconnect Pathfinding ,
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