Van Nhat Anh, Tran
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1

Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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2

Cu/Dielectric hybrid bonding among Glass and Si:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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3

Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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4

Defect evolution during through-silicon via copper electrop..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Van Nhat Anh, Tran ; Venkataraman, Nandini ; Tao, Meng... - p. 1059-1062 , 2023
 
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5

Communication—A Rotating Ring Disk Study to Monitor the Con..:

Van Nhat Tran, Anh ; Hirato, Tetsuji ; Kondo, Kazuo
Journal of The Electrochemical Society.  168 (2021)  5 - p. 052501 , 2021
 
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6

Electrical Characterization and Reliability Studies of Nano..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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7

Targeting glutamine addiction in meningioma:

Tran, Anh Nhat
Neuro-Oncology.  24 (2022)  4 - p. 569-570 , 2022
 
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10

Mesenchymal stemlike cells in glioblastoma:

Tran, Anh Nhat ; Horbinski, Craig
Neuro-Oncology.  22 (2020)  10 - p. 1409-1410 , 2020
 
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11

High TEC Copper to Connect Copper Bond Pads for Low Tempera..:

Tran, Anh Van Nhat ; Hirato, Tetsuji ; Kondo, Kazuo
ECS Journal of Solid State Science and Technology.  9 (2020)  12 - p. 124003 , 2020
 
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14

Monitoring of SPS Concentration by the Ring Current Using a..:

Tran, Anh Van Nhat ; Van Hoang, Ha ; Hirato, Tetsuji.
Journal of The Electrochemical Society.  166 (2019)  14 - p. D742-D746 , 2019
 
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