E-LIB Suche - Ergebnisse für: Velenis, E.

1

Effect of handling characteristics on minimum time cornerin..:

Smith, E. N. ; Velenis, E. ; Tavernini, D..
Vehicle System Dynamics. 56 (2017) 2 - p. 221-248 , 2017

Link: https://doi.org/10.1080/..

2

Optimal control of motorsport differentials:

Tremlett, A.J. ; Massaro, M. ; Purdy, D.J....
Vehicle System Dynamics. 53 (2015) 12 - p. 1772-1794 , 2015

Link: https://doi.org/10.1080/..

3

Haptic steering support for driving near the vehicle's hand..:

Katzourakis, D. I. ; Velenis, E. ; Holweg, E..
International Journal of Automotive Technology. 15 (2014) 1 - p. 151-163 , 2014

Link: https://doi.org/10.1007/..

4

Final Comments by the Authors:

Velenis, E. ; Tsiotras, P. ; Lu, J.
European Journal of Control. 14 (2008) 4 - p. 326-328 , 2008

Link: https://doi.org/10.1016/..

5

Minimum-Time Travel for a Vehicle with Acceleration Limits:..:

Velenis, E. ; Tsiotras, P.
Journal of Optimization Theory and Applications. 138 (2008) 2 - p. 275-296 , 2008

Link: https://doi.org/10.1007/..

6

Dynamic tyre friction models for combined longitudinal and ..:

Velenis, E. ; Tsiotras, P. ; Canudas-de-Wit, C..
Vehicle System Dynamics. 43 (2005) 1 - p. 3-29 , 2005

Link: https://doi.org/10.1080/..

7

Optimal control of motorsport differentials:

Tremlett, AJ ; Massaro, M ; Purdy, DJ...
qt6dw2255c. , 2015

Link: https://escholarship.org..

8

Cost-effective RF interposer platform on low-resistivity Si..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Sun, X. ; Slabbekoorn, J. ; Sinha, S.... - p. 7-11 , 2022

Link: https://doi.org/10.1109/..

9

(Why do we need) Wireless Heterogeneous Integration (anyway..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),

Peeters, M. ; Sinha, S. ; Sun, X.... - p. 256-257 , 2022

Link: https://doi.org/10.1109/..

10

Characterization of Impact of Vertical Stress on FinFETs:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),

Furuhashi, T. ; Haneda, M. ; Sasaki, T.... - p. 1-4 , 2019

Link: https://doi.org/10.23919..

11

HIGH DENSITY AND HIGH BANDWIDTH CHIP-TO-CHIP CONNECTIONS WI..:

, In: 2018 International Wafer Level Packaging Conference (IWLPC),

Podpod ; Beyne, E. ; Velenis, D.... - p. 1-5 , 2018

Link: https://doi.org/10.23919..

12

Process development to enable 3D IC multi-tier die bond for..:

, In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC),

Hu, Y. H. ; Liu, C. S. ; Chen, M. T.... - p. 572-575 , 2014

Link: https://doi.org/10.1109/..