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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
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CMOS Scaling by Nanosheet Device Architectures and Backside..:
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2023 International Electron Devices Meeting (IEDM) ,
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3D Stacked Devices and MOL Innovations for Post-Nanosheet C..:
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2023 45th Annual EOS/ESD Symposium (EOS/ESD) ,
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Impact of Backside Power Delivery Network with Buried Power..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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PPA and Scaling Potential of Backside Power Options in N2 a..:
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2023 21st International Workshop on Junction Technology (IWJT) ,
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Nanosheet-based Device Architectures with Front/Backside Co..:
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2023 International Electron Devices Meeting (IEDM) ,
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Backside Power Delivery: Game Changer and Key Enabler of Ad..:
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2023 International Electron Devices Meeting (IEDM) ,
14
ESD Challenges in 300nm Si Substrate of DTCO/STCO Scaling O..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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