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Ventosa, Caroline
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1

Efficiency of H2O Diffusion Barriers at Si-Si Direct Bondin..:

Moriceau, Hubert ; Rieutord, François ; Libralesso, Laure...
ECS Transactions.  33 (2010)  4 - p. 467-474 , 2010
Link: https://doi.org/10.1149/..
 
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2

Physics of direct bonding: Applications to 3D heterogeneous..:

Gueguen, Pierric ; Ventosa, Caroline ; Cioccio, Léa Di...
Microelectronic Engineering.  87 (2010)  3 - p. 477-484 , 2010
Link: https://doi.org/10.1016/..
 
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3

Effect of Pre-bonding Thermal Treatment on the Bonding Inte..:

Ventosa, Caroline ; Rieutord, François ; Libralesso, Laure...
ECS Transactions.  16 (2008)  8 - p. 361-368 , 2008
Link: https://doi.org/10.1149/..
 
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4

Low Temperature Wafer Bonding:

Fournel, Frank ; Moriceau, H. ; Ventosa, Caroline...
ECS Transactions.  16 (2008)  8 - p. 475-488 , 2008
Link: https://doi.org/10.1149/..
 
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5

Lattice Strain and Strain Evolution in Hydrogen-Implanted M..:

Ventosa-Moulet, Caroline ; Hayashi, Sumiko ; Goorsky, Mark S.
ECS Transactions.  33 (2010)  4 - p. 249-254 , 2010
Link: https://doi.org/10.1149/..
 
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6

Advanced Characterization of a Direct Wafer Bonding-compati..:

Ferain, Isabelle Pauline ; Kou, Xiaolu ; Moulet-Ventosa, Caroline..
ECS Transactions.  50 (2013)  7 - p. 331-340 , 2013
Link: https://doi.org/10.1149/..
 
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7

Chemical-Mechanical Polishing YAG For Wafer Bonding:

Mc Kay, Jeffrey ; Moulet-Ventosa, Caroline ; Goorsky, M. S.
ECS Transactions.  50 (2013)  7 - p. 387-391 , 2013
Link: https://doi.org/10.1149/..
 
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8

The plasma separation card as a novel solution for enhancin..:

Kiyaga, Charles ; Makoha, Caroline ; Nkugwa, Ivan...
PLOS Global Public Health.  3 (2023)  6 - p. e0002099 , 2023
Link: https://doi.org/10.1371/..
 
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