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Verdingovas, Vadimas
18  results:
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1

Compatibility study of no-clean flux residue and conformal ..:

Li, Feng ; Verdingovas, Vadimas ; Mantis, Ioannis..
Microelectronics Reliability.  159 (2024)  - p. 115452 , 2024
Link: https://doi.org/10.1016/..
 
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2

Influence of Ni, Bi, and Sb additives on the microstructure..:

Li, Feng ; Verdingovas, Vadimas ; Dirscherl, Kai...
Journal of Materials Science: Materials in Electronics.  31 (2020)  18 - p. 15308-15321 , 2020
Link: https://doi.org/10.1007/..
 
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3

Circuit analysis to predict humidity related failures in el..:

Joshy, Salil ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl.
Microelectronics Reliability.  93 (2019)  - p. 81-88 , 2019
Link: https://doi.org/10.1016/..
 
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4

Humidity-related failures in electronics: effect of binary ..:

Piotrowska, Kamila ; Verdingovas, Vadimas ; Ambat, Rajan
Journal of Materials Science: Materials in Electronics.  29 (2018)  20 - p. 17834-17852 , 2018
Link: https://doi.org/10.1007/..
 
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5

Analysis of surface insulation resistance related failures ..:

Verdingovas, Vadimas ; Joshy, Salil ; Jellesen, Morten Stendahl.
Circuit World.  43 (2017)  2 - p. 45-55 , 2017
Link: https://doi.org/10.1108/..
 
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6

Colorimetric visualization of tin corrosion: A method for e..:

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
Microelectronics Reliability.  73 (2017)  - p. 158-166 , 2017
Link: https://doi.org/10.1016/..
 
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7

Effect of pulsed voltage on electrochemical migration of ti..:

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
Journal of Materials Science: Materials in Electronics.  26 (2015)  10 - p. 7997-8007 , 2015
Link: https://doi.org/10.1007/..
 
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8

Relative effect of solder flux chemistry on the humidity re..:

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
Soldering & Surface Mount Technology.  27 (2015)  4 - p. 146-156 , 2015
Link: https://doi.org/10.1108/..
 
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9

Decomposition of no-clean solder flux systems and their eff..:

Conseil, Hélène ; Verdingovas, Vadimas ; Jellesen, Morten S..
Journal of Materials Science: Materials in Electronics.  27 (2015)  1 - p. 23-32 , 2015
Link: https://doi.org/10.1007/..
 
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10

Effect of iodine on the corrosion of Au–Al wire bonds:

Verdingovas, Vadimas ; Müller, Lutz ; Jellesen, Morten Stendahl..
Corrosion Science.  97 (2015)  - p. 161-171 , 2015
Link: https://doi.org/10.1016/..
 
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11

Solder Flux Residues and Humidity-Related Failures in Elect..:

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
Journal of Electronic Materials.  44 (2015)  4 - p. 1116-1127 , 2015
Link: https://doi.org/10.1007/..
 
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12

Analysis of mode-hopping effect in Fabry–Pérot multiple-qua..:

Pralgauskaitė, Sandra ; Palenskis, Vilius ; Matukas, Jonas...
Solid-State Electronics.  79 (2013)  - p. 104-110 , 2013
Link: https://doi.org/10.1016/..
 
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13

Allergic nickel dermatitis caused by playing the guitar: ca..:

Friis, Ulrik F. ; Menné, Torkil ; Jellesen, Morten S....
Contact Dermatitis.  67 (2012)  2 - p. 101-103 , 2012
Link: https://doi.org/10.1111/..
 
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14

Circuit analysis to predict humidity related failures in el..:

Joshy, Salil ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl.
https://orbit.dtu.dk/en/publications/15fa5f26-70b4-4334-a212-0b03490e494a.  , 2019
Link: https://orbit.dtu.dk/en/..
 
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15

Implementation of electrochemical impedance spectroscopy (E..:

Lauser, Simone ; Eckold, Pierre ; Richter, Theresia..
Lauser , S , Eckold , P , Richter , T , Verdingovas , V & Ambat , R 2018 , ' Implementation of electrochemical impedance spectroscopy (EIS) for assessment of humidity induced failure mechanisms on PCBAs ' , Paper presented at EUROCOR 2018 - Applied science with contstant awareness , Cracow , Poland , 09/09/2018 - 13/09/2018 ..  , 2018
Link: https://orbit.dtu.dk/en/..
 
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