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2024 IEEE Latin American Electron Devices Conference (LAEDC) ,
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Temperature Dependence of Quasi–Ballistic Transport in n–Ty..:
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2024 IEEE International Reliability Physics Symposium (IRPS) ,
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Thermal Performance Evaluation of Multi-Core SOCs Using Pow..:
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2023 IEEE International Reliability Physics Symposium (IRPS) ,
3
Towards Chip-Package-System Co-optimization of Thermally-li..:
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2023 International Electron Devices Meeting (IEDM) ,
4
Backside Power Delivery: Game Changer and Key Enabler of Ad..:
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2023 International Electron Devices Meeting (IEDM) ,
5
Charge Movement in Back Barrier Induced Time-Dependent On-S..:
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ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC) ,
6
III-V HBTs on 300 mm Si substrates using merged nano-ridges..:
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2022 International Electron Devices Meeting (IEDM) ,
7
Insights into Scaled Logic Devices Connected from Both Wafe..:
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2022 International Electron Devices Meeting (IEDM) ,
8
Thermal Modelling of GaN & InP RF Devices with Intrinsic Ac..:
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2022 International Electron Devices Meeting (IEDM) ,
9
III-V/III-N technologies for next generation high-capacity ..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
10
Self-Heating in iN8–iN2 CMOS Logic Cells: Thermal Impact of..:
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2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
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