Vermeersch, Bjorn
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1

Experimentally Validated Thermal Modeling Prediction for BE..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chang, Xinyue ; Oprins, Herman ; Vermeersch, Bjorn... - p. 498-505 , 2024
 
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3

Calibrated fast thermal calculation and experimental charac..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
 
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4

Towards accurate temperature prediction in BEOL for reliabi..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
 
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Impact of 3-D Integration on Thermal Performance of RISC-V ..:

Venkateswarlu, Sankatali ; Mishra, Subrat ; Oprins, Herman...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  31 (2023)  12 - p. 1896-1904 , 2023
 
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6

Package level thermal analysis of backside power delivery n..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
 
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Impact of FEOL cross-heating on the thermal performance of ..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
 
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8

Thermal analysis of advanced back-end-of-line structures an..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
 
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9

Thermal Performance Analysis of Mempool RISC-V Multicore So:

Venkateswarlu, Sankatali ; Mishra, Subrat ; Oprins, Herman...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  30 (2022)  11 - p. 1668-1676 , 2022
 
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10

Impact of channel thickness scaling on the performance of G..:

, In: ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC),
Alian, Alireza ; Rodriguez, Raul ; Yadav, Sachin... - p. 384-387 , 2022
 
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11

Performance Trade-Off Scenarios for GAA Nanosheet FETs Cons..:

, In: ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC),
 
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