E-LIB Suche - Ergebnisse für: Vianco, P. T.

1

Interface reactions between copper and 50In-50Pb (wt%) allo..:

Vianco, P.T. ; Kilgo, A.C. ; McKenzie, B.M...
Journal of Alloys and Metallurgical Systems. 5 (2024) - p. 100066 , 2024

Link: https://doi.org/10.1016/..

2

Interface Embrittlement Between 63Sn-37Pb Solder and Au Lay..:

Vianco, P. T. ; Kilgo, A. C. ; McKenzie, B. B...
Journal of Electronic Materials. 52 (2022) 1 - p. 628-652 , 2022

Link: https://doi.org/10.1007/..

3

Interface Embrittlement Between 63Sn-37Pb Solder and Au Lay..:

Vianco, P. T. ; Kilgo, A. C. ; McKenzie, B. M...
Journal of Electronic Materials. 51 (2022) 11 - p. 6431-6453 , 2022

Link: https://doi.org/10.1007/..

4

Mitigation of Long Whisker Growth Based upon the Dynamic Re..:

Vianco, P. T. ; Cummings, D. P. ; Kotula, P. G....
Journal of Electronic Materials. 49 (2019) 1 - p. 888-904 , 2019

Link: https://doi.org/10.1007/..

5

Electronic Packaging: Solder Mounting Technologies:

, In: Reference Module in Materials Science and Materials Engineering,

Vianco, P.T. ; Feng, Y , 2016

Link: https://doi.org/10.1016/..

6

Validation of the Dynamic Recrystallization (DRX) Mechanism..:

Vianco, P. T. ; Neilsen, M. K. ; Rejent, J. A..
Journal of Electronic Materials. 44 (2015) 10 - p. 4012-4034 , 2015

Link: https://doi.org/10.1007/..

7

Interface flow mechanism for tin whisker growth:

Howard, H.P. ; Cheng, J. ; Vianco, P.T..
Acta Materialia. 59 (2011) 5 - p. 1957-1963 , 2011

Link: https://doi.org/10.1016/..

8

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whi..:

Vianco, P. T. ; Rejent, J. A.
Journal of Electronic Materials. 38 (2009) 9 - p. 1815-1825 , 2009

Link: https://doi.org/10.1007/..

9

Very long-term aging of 52In–48Sn (at.%) solder joints on C..:

Susan, D. F. ; Rejent, J. A. ; Hlava, P. F..
Journal of Materials Science. 44 (2009) 2 - p. 545-555 , 2009

Link: https://doi.org/10.1007/..

10

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whi..:

Vianco, P. T. ; Rejent, J. A.
Journal of Electronic Materials. 38 (2009) 9 - p. 1826-1837 , 2009

Link: https://doi.org/10.1007/..

11

Scavenging of Ti by Fe-Ni-Co in Ag-Cu-Ti Active Metal Braze..:

Hlava, P F ; Vianco, P T ; Stephens, J J
Microscopy and Microanalysis. 11 (2005) S02 - p. , 2005

Link: https://doi.org/10.1017/..

12

A methodology to establish baseline metrics for assessing t..:

Vianco, P.T. ; Rejent, J.A.
Soldering & Surface Mount Technology. 14 (2002) 2 - p. 26-34 , 2002

Link: https://doi.org/10.1108/..

13

Electronic Packaging: Solder Mounting Technologies:

, In: Encyclopedia of Materials: Science and Technology,

Vianco, P.T. - p. 2705-2715 , 2001

Link: https://doi.org/10.1016/..

14

The impact of process parameters on gold elimination from s..:

Vianco, P.T. ; Kilgo, A.C.
Soldering & Surface Mount Technology. 12 (2000) 2 - p. 24-31 , 2000

Link: https://doi.org/10.1108/..

15

Coarsening of the Sn-Pb solder microstructure in constituti..:

Vianco, P. T. ; Burchett, S. N. ; Neilsen, M. K...
Journal of Electronic Materials. 28 (1999) 11 - p. 1290-1298 , 1999

Link: https://doi.org/10.1007/..