Villa, Riccardo
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2

Direct Copper Interconnection: Laser Direct Structuring and..:

, In: 2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac),
 
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8

Wire loop characterization for wire sweep reduction:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
 
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9

UV Laser Copper Pad Surface Exposure for Laser Direct Struc..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
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10

Social, affective, and non-motoric bodily cues to the Sense..:

Villa, Riccardo ; Ponsi, Giorgia ; Scattolin, Marina..
Neuroscience & Biobehavioral Reviews.  142 (2022)  - p. 104900 , 2022
 
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11

Wire sweep phenomenon overview by Ishikawa diagram:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Leone, Federico ; Viviani, Fulvio ; Grech, Elijah. - p. 609-615 , 2022
 
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15

Hep3Gel: A Shape-Shifting Extracellular Matrix-Based, Three..:

Guagliano, Giuseppe ; Volpini, Cristina ; Sardelli, Lorenzo...
ACS Biomaterials Science & Engineering.  9 (2022)  1 - p. 211-229 , 2022
 
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