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2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ,
2
Direct Copper Interconnection: Laser Direct Structuring and..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
8
Wire loop characterization for wire sweep reduction:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
9
UV Laser Copper Pad Surface Exposure for Laser Direct Struc..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
11