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Volders, Henny
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1

Study of metal barrier deposition-induced damage to porous ..:

Zhao, Larry ; Volders, Henny ; Baklanov, Mikhail...
Microelectronic Engineering.  88 (2011)  9 - p. 3030-3034 , 2011
Link: https://doi.org/10.1016/..
 
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2

Texture characterization of Cu interconnects with different..:

Wilson, Christopher J. ; Zhao, Chao ; Volders, Henny...
Microelectronic Engineering.  88 (2011)  5 - p. 656-660 , 2011
Link: https://doi.org/10.1016/..
 
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3

Impact of "terminal effect" on Cu electrochemical depositio..:

Armini, Silvia ; Tokei, Zsolt ; Volders, Henny...
Microelectronic Engineering.  88 (2011)  5 - p. 754-759 , 2011
Link: https://doi.org/10.1016/..
 
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4

In situ X-ray diffraction study of self-forming barriers fr..:

Wilson, Christopher J. ; Volders, Henny ; Croes, Kristof...
Microelectronic Engineering.  87 (2010)  3 - p. 398-401 , 2010
Link: https://doi.org/10.1016/..
 
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5

Copper Plating on Resistive Substrates, Diffusion Barrier a..:

Radisic, Aleksandar ; Nagar, Magi ; Strubbe, Katrien...
ECS Transactions.  25 (2010)  27 - p. 175-184 , 2010
Link: https://doi.org/10.1149/..
 
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6

Integration and Dielectric Reliability of 30 nm Half Pitch ..:

Demuynck, Steven ; Huffman, Craig ; Claes, Martine...
Japanese Journal of Applied Physics.  49 (2010)  4S - p. 04DB05 , 2010
Link: https://doi.org/10.1143/..
 
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7

Dielectric Reliability of 50 nm Half Pitch Structures in Au..:

Demuynck, Steven ; Kim, Honggun ; Huffman, Craig...
Japanese Journal of Applied Physics.  48 (2009)  4S - p. 04C018 , 2009
Link: https://doi.org/10.1143/..
 
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