Vuorinen, V.
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1

Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstruct..:

Emadi, F. ; Vuorinen, V. ; Ross, G..
Materials Science and Engineering: A.  881 (2023)  - p. 145398 , 2023
 
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2

Low-temperature die attach for power components: Cu-Sn-In s..:

, In: 2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM),
Emadi, F. ; Liu, S. ; Klami, A.... - p. 1-6 , 2022
 
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3

Investigation of the microstructural evolution and detachme..:

Emadi, F. ; Vuorinen, V. ; Dong, H...
Journal of Alloys and Compounds.  890 (2022)  - p. 161852 , 2022
 
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4

Aluminium corrosion in power semiconductor devices:

Leppänen, J. ; Ingman, J. ; Peters, J.-H....
Microelectronics Reliability.  137 (2022)  - p. 114766 , 2022
 
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5

Microstructural and mechanical characterization of Cu/Sn SL..:

Emadi, F. ; Vuorinen, V. ; Mertin, S...
Journal of Alloys and Compounds.  929 (2022)  - p. 167228 , 2022
 
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6

An artificial intelligence based-model for heat transfer mo..:

Khosravi, A. ; Laukkanen, T. ; Saari, K..
Case Studies in Thermal Engineering.  28 (2021)  - p. 101613 , 2021
 
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8

A humidity-induced novel failure mechanism in power semicon..:

Leppänen, J. ; Ross, G. ; Vuorinen, V....
Microelectronics Reliability.  123 (2021)  - p. 114207 , 2021
 
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9

Computational and experimental investigation of a swirl noz..:

Laurila, E. ; Koivisto, S. ; Kankkunen, A....
International Journal of Multiphase Flow.  128 (2020)  - p. 103278 , 2020
 
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10

Wafer Level Solid Liquid Interdiffusion Bonding: Formation ..:

Vuorinen, V. ; Dong, H. ; Ross, G....
Journal of Electronic Materials.  50 (2020)  3 - p. 818-824 , 2020
 
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11

Analysis of viscous fluid flow in a pressure-swirl atomizer..:

Laurila, E. ; Roenby, J. ; Maakala, V....
International Journal of Multiphase Flow.  113 (2019)  - p. 371-388 , 2019
 
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12

Wall-distance-free formulation for SSTk-ωmodel:

Rahman, M.M. ; Vuorinen, V. ; Taghinia, J..
European Journal of Mechanics - B/Fluids.  75 (2019)  - p. 71-82 , 2019
 
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