E-LIB Suche - Ergebnisse für: Vuorinen, Vesa

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Bonding of ceramics to silver‐coated titanium—A combined th..:

Vuorinen, Vesa ; Kouhia, Reijo ; Könönen, Mauno.
Journal of Biomedical Materials Research Part B: Applied Biomaterials. 112 (2024) 5 - p. , 2024

Link: https://doi.org/10.1002/..

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Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liq..:

Golim, Obert ; Vuorinen, Vesa ; Wernicke, Tobias..
Microelectronic Engineering. 286 (2024) - p. 112140 , 2024

Link: https://doi.org/10.1016/..

3

Investigative characterization of delamination at TiW-Cu in..:

Golim, Obert ; Vuorinen, Vesa ; Ross, Glenn..
Materials Characterization. 209 (2024) - p. 113772 , 2024

Link: https://doi.org/10.1016/..

4

Novel low-temperature interconnects for 2.5/3D MEMS integra..:

Emadi, Fahimeh ; Vuorinen, Vesa ; Liu, Shenyi.
IEEE Transactions on Components, Packaging and Manufacturing Technology. , 2024

Link: https://doi.org/10.1109/..

5

Recent Developments in Low Temperature Wafer Level Metal Bo..:

Wernicke, Tobias ; Rebhan, Bernhard ; Vuorinen, Vesa...
ECS Transactions. 112 (2023) 3 - p. 247-263 , 2023

Link: https://doi.org/10.1149/..

6

Impact of Inherent Design Limitations for Cu–Sn SLID Microb..:

Tiwary, Nikhilendu ; Ross, Glenn ; Vuorinen, Vesa.
IEEE Transactions on Electron Devices. 70 (2023) 1 - p. 222-229 , 2023

Link: https://doi.org/10.1109/..

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Achieving low-temperature wafer level bonding with Cu-Sn-In..:

Golim, Obert ; Vuorinen, Vesa ; Ross, Glenn...
Scripta Materialia. 222 (2023) - p. 114998 , 2023

Link: https://doi.org/10.1016/..

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Utilizing Co as a contact metallization for wafer-level Cu-..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),

Emadi, Fahimeh ; Vuorinen, Vesa ; Paulasto-Krockel, Mervi - p. 359-363 , 2022

Link: https://doi.org/10.1109/..

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Finite Element Simulation of Solid–Liquid Interdiffusion Bo..:

Tiwary, Nikhilendu ; Vuorinen, Vesa ; Ross, Glenn.
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12 (2022) 5 - p. 847-856 , 2022

Link: https://doi.org/10.1109/..

10

Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level S..:

Vuorinen, Vesa ; Ross, Glenn ; Klami, Anton...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12 (2022) 3 - p. 446-453 , 2022

Link: https://doi.org/10.1109/..

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