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2023 IEEE 23rd International Conference on Nanotechnology (NANO) ,
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Recent Advances and Challenges of 2D Fourier Transform Comp..:
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2023 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS) ,
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MEMS-Silicon Chip Bonding Verification using GHz Pulse-echo..:
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2022 IEEE International Ultrasonics Symposium (IUS) ,
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A Study of Bonding Materials for GHz Ultrasonic Wavefront C..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Demonstration of Vertically Integrated POP using FOWLP Appr..:
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2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ,
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Thermo-mechanical design of fan-out wafer level package for..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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High-Performance Amplifier Package Design for Heterogenous ..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
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Silicon Optical Electrical Interposer - Fiber to the Chip:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
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Comprehensive Study on the Encapsulation for the Intelligen..:
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2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ,
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Magnetic Shielding and Packaging of STT MRAM:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Investigation of Void-free Chip-to-Chip Bonding Methods for..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Development and Demonstration of a Novel Immersion Two Phas..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Development of Flip-Chip Packaging for Monolithic Microwave..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Pressure-assist Silver Sintering Paste for SiC Power Device..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Attachment of Alignment Fibre on Interposer for Fibre Optic..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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