Wan, Caiping
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2

Annealing temperature dependent properties for Ni/Ti/W Ohmi..:

Ge, Niannian ; Wan, Caiping ; Jin, Zhi.
Semiconductor Science and Technology.  38 (2023)  7 - p. 074005 , 2023
 
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3

The effects of stress on interfacial properties and flatban..:

Lu, Wenhao ; Wan, Caiping ; Ge, Niannian..
Microelectronics Reliability.  147 (2023)  - p. 115041 , 2023
 
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6

Improving the reliability of MOS capacitor on 4H-SiC (0001)..:

Wan, Caiping ; Zhang, Yuanhao ; Lu, Wenhao...
Semiconductor Science and Technology.  37 (2022)  5 - p. 055008 , 2022
 
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7

Effects of sequential annealing in low oxygen partial-press..:

Luo, Zhipeng ; Wan, Caiping ; Jin, Zhi.
Semiconductor Science and Technology.  36 (2021)  4 - p. 045021 , 2021
 
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9

The Influence to Uniform Current Distribution of SiC MOSFET..:

Lu, Wenhao ; Wan, Caiping ; Zhang, Xizi...
IOP Conference Series: Earth and Environmental Science.  772 (2021)  1 - p. 012032 , 2021
 
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11

Effect of pulsed UV laser irradiation on 4H-SiC MOS with th..:

Luo, Zhipeng ; Wan, Caiping ; Xu, Hengyu..
Journal of Materials Science: Materials in Electronics.  31 (2020)  8 - p. 5838-5842 , 2020
 
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12

Al(ON) gate dielectrics for 4H-SiC MOS devices:

Xia, Jinghua ; Wang, Shihai ; Tian, Lixin...
Journal of Crystal Growth.  532 (2020)  - p. 125434 , 2020
 
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13

Influence of curvature induced stress on first principle ca..:

Xu, Hengyu ; Wan, Caiping ; Li, Bo..
Microelectronics Reliability.  100-101 (2019)  - p. 113317 , 2019
 
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