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Wang, Chen-Chao
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1

A Compact AiP with a Dual-Polarized 1x4 Antenna Array for 5..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsieh, Sheng-Chi ; Huang, Hong-Sheng ; Hsiao, Wen-Chun... - p. 189-190 , 2024
Link: https://doi.org/10.23919..
 
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2

Semiconductor Fan-Out Polymer Adhesion on Physical Vapor De..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lin, Nien-Chun ; Shih, Hsin-Chih ; Tsai, Ching-I... - p. 179-180 , 2024
Link: https://doi.org/10.23919..
 
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3

A Novel Detection Applied on Micro Defect in Bump Interface..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Yi-Sheng ; Hsiao, Yu-Hsiang ; Liu, Cheng-Hsin... - p. 1804-1807 , 2024
Link: https://doi.org/10.1109/..
 
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4

Mold Flow Strategy Improvement for Power Module:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Huang, Bing-Yuan ; Lu, Ying-Xu ; Huang, Hung-Hsien.. - p. 167-168 , 2024
Link: https://doi.org/10.23919..
 
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5

High Performance Antenna-in-Package with Test Socket for Mi..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Ho, Cheng-Yu ; Hsiao, Wen-Chun ; Hsieh, Sheng-Chi.. - p. 191-192 , 2024
Link: https://doi.org/10.23919..
 
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6

Innovative Two-Phase Immersion Cooling Solutions for high-p..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sharma, Sumit ; Ahmad, Aqbal ; Huang, ICheng... - p. 1515-1515 , 2024
Link: https://doi.org/10.1109/..
 
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7

Effect of Flip-Chip Ball Grid Array Structure on Capillary ..:

Hung, Hao-Hsi ; Cheng, Yu-Chi ; Hwang, Sheng-Jye...
Results in Engineering.  , 2024
Link: https://doi.org/10.1016/..
 
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8

Investigation into the Impact of Layout Design on Thermal P..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chen, Tang-Yuan ; Chen, Dao-Long ; Chiu, Frank.. - p. 249-250 , 2024
Link: https://doi.org/10.23919..
 
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9

Void Migration Kinetics in Fine Line Cu RDL under Electric ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Huang, Yen-Cheng ; Tsai, Min-Yan ; Lin, Ting-Chun... - p. 576-580 , 2024
Link: https://doi.org/10.1109/..
 
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10

A Compact mmWave 1x4 Antenna Array Design with Shorted Para..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsieh, Sheng-Chi ; Huang, Hong-Sheng ; Hsiao, Wen-Chun... - p. 743-747 , 2024
Link: https://doi.org/10.1109/..
 
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11

Integrated Design Ecosystem for Chiplets Heterogeneous Inte..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Wang, Chen-Chao ; Huang, Chih-Yi. - p. 1048-1053 , 2024
Link: https://doi.org/10.1109/..
 
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12

Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Yang, Hung-Chun ; Lai, Wei-Hong ; Kao, Chin-Li.. - p. 151-152 , 2024
Link: https://doi.org/10.23919..
 
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13

Thermal resistance prediction model for IC packaging optimi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Guan-Wei ; Lin, Yan-Cheng ; Hsu, Chung-Hsiang... - p. 1593-1598 , 2024
Link: https://doi.org/10.1109/..
 
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14

Enhanced Heat Spreading Performance of Printed Circuit Boar..:

Yu, Jui-Cheng ; Liao, Chien-Neng ; Chang, Yu-Hsiang...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  2 - p. 221-228 , 2024
Link: https://doi.org/10.1109/..
 
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15

High Acceleration Dynamic Methodology for Board-Level Shock..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yu, Min-Cheng ; Wu, Nan-Yi ; Wang, Wu-Lung... - p. 1213-1218 , 2024
Link: https://doi.org/10.1109/..
 
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