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Wang, Fangcheng
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1

A popcorn-inspired strategy for compounding graphene@NiFe2O..:

Liu, Mingjie ; Wang, Zhiyuan ; Song, Zhaoqiang...
Nature Communications.  15 (2024)  1 - p. , 2024
Link: https://doi.org/10.1038/..
 
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2

Oriented design of wafer-level stacking structures to enhan..:

Wang, Fangcheng ; Liu, Qiang ; Li, Jinhui...
Optics & Laser Technology.  169 (2024)  - p. 110169 , 2024
Link: https://doi.org/10.1016/..
 
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3

Crystal-Structure Matches in Solid-Solid Phase Transitions:

Wang, Fang-Cheng ; Ye, Qi-Jun ; Zhu, Yu-Cheng.
Physical Review Letters.  132 (2024)  8 - p. , 2024
Link: https://doi.org/10.1103/..
 
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4

Effect of Different Defects in Temporary Bonding on Laser D..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Jieyuan ; Wang, Fangcheng ; Liu, Qiang... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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5

Laser‐Induced Transient Self‐Organization of TiNxNano‐Filam..:

Wang, Fangcheng ; Guo, Zhenbin ; Wang, Zhiyuan...
Advanced Materials.  , 2023
Link: https://doi.org/10.1002/..
 
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6

Ablation Behaviour of Photosensitive Materials in Laser Deb..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Fangcheng ; Liu, Qiang ; Wang, Xuefan... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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7

Laser‐Induced Transient Self‐Organization of TiNx Nano‐Fila..:

Wang, Fangcheng ; Guo, Zhenbin ; Wang, Zhiyuan...
Advanced Materials.  35 (2023)  15 - p. , 2023
Link: https://doi.org/10.1002/..
 
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8

A Laser‐Processed Carbon‐Titanium Carbide Heterostructure E..:

Zhang, Zhuo ; Wang, Zhiyuan ; Wang, Fangcheng...
Small.  19 (2023)  21 - p. , 2023
Link: https://doi.org/10.1002/..
 
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9

A Single-layer Photosensitive Polymer Material for Temporar..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Xuefan ; Liu, Qiang ; Wang, Fangcheng... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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10

Temporary Bonding and Debonding in Advanced Packaging: Rece..:

Mo, Zihao ; Wang, Fangcheng ; Li, Jinhui...
Electronics.  12 (2023)  7 - p. 1666 , 2023
Link: https://doi.org/10.3390/..
 
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11

Nondestructive Laser Debonding of Designable Responsive and..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Fangcheng ; Liu, Qiang ; Wang, Xuefan... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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12

Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electro..:

Wang, Fangcheng ; Liu, Qiang ; Xia, Jianwen...
Advanced Materials Technologies.  8 (2022)  7 - p. , 2022
Link: https://doi.org/10.1002/..
 
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13

A Novel Single-Layer High-Temperature-Resistant Adhesive La..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Dai, Wenxue ; Liu, Qiang ; Li, Zhipeng... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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14

Inlaying Bismuth Nanoparticles on Graphene Nanosheets by Ch..:

Zhu, Haojie ; Wang, Fangcheng ; Peng, Lu...
Angewandte Chemie International Edition.  62 (2022)  2 - p. , 2022
Link: https://doi.org/10.1002/..
 
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15

A high-frequency flexible symmetric supercapacitor prepared..:

Zhao, Guang-yao ; Wang, Fang-cheng ; Liu, Ming-jie...
New Carbon Materials.  37 (2022)  3 - p. 556-563 , 2022
Link: https://doi.org/10.1016/..
 
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