E-LIB Suche - Ergebnisse für: Wang, Fengjiang

1

CHEABC-QCRP: A novel QoS-aware cluster routing protocol for..:

Wang, Fengjiang ; Rao, Chuchu ; Fang, Xiaosheng.
Simulation Modelling Practice and Theory. 134 (2024) - p. 102951 , 2024

Link: https://doi.org/10.1016/..

2

Effect of minor Sb addition on microstructure, interfacial ..:

Wang, Fengjiang ; Lv, Pengcheng ; Zhang, Jiayu
Journal of Materials Science: Materials in Electronics. 35 (2024) 18 - p. , 2024

Link: https://doi.org/10.1007/..

3

CALPHAD aided mechanical properties screening in full compo..:

Liao, Mingqing ; Gong, Hongshun ; Qu, Nan...
International Journal of Refractory Metals and Hard Materials. 113 (2023) - p. 106191 , 2023

Link: https://doi.org/10.1016/..

4

A New Adaptive Elite Evolutionary Algorithm for Task Alloca..:

, In: 2023 IEEE 11th International Conference on Information, Communication and Networks (ICICN),

Wang, Mengfei ; Fei, Hongmei ; Jia, Dingyi... - p. 57-62 , 2023

Link: https://doi.org/10.1109/..

5

Interfacial structure and strength of Al‐25Si‐4Mg‐1Cu joint..:

Ma, Qiang ; Chen, Yongwei ; Li, Shengguo...
Engineering Reports. 5 (2023) 8 - p. , 2023

Link: https://doi.org/10.1002/..

6

In or Ni addition on mechanical properties and interfacial ..:

Chen, Jiawei ; Liao, Mingqing ; Wang, Fengjiang
Journal of Materials Science: Materials in Electronics. 34 (2023) 20 - p. , 2023

Link: https://doi.org/10.1007/..

7

Elastic and thermodynamic properties of B2-MgX intermetalli..:

Liao, Mingqing ; Zhou, Fei ; Wang, Fengjiang..
Vacuum. 218 (2023) - p. 112646 , 2023

Link: https://doi.org/10.1016/..

8

Thermomigration behavior of Sn–Bi joints under different su..:

Wu, Jun ; Wang, Kaipeng ; Wang, Fengjiang.
Journal of Materials Science: Materials in Electronics. 33 (2022) 10 - p. 8127-8139 , 2022

Link: https://doi.org/10.1007/..

9

P212121-C16: An ultrawide bandgap and ultrahard carbon allo..:

Liao, Mingqing ; Maimaitimusha, Jumahan ; Zhang, Xueting..
Frontiers of Physics. 17 (2022) 6 - p. , 2022

Link: https://doi.org/10.1007/..

10

Effect of trace Ge on interfacial reaction and shear streng..:

Yang, Weiran ; Ding, Yu ; Liao, Mingqing.
Journal of Materials Science: Materials in Electronics. 33 (2022) 21 - p. 17137-17151 , 2022

Link: https://doi.org/10.1007/..

11

P2221-C8: A novel carbon allotrope denser than diamond:

Liao, Mingqing ; Wang, Fengjiang ; Zhu, Jingchuan..
Scripta Materialia. 212 (2022) - p. 114549 , 2022

Link: https://doi.org/10.1016/..

12

Development of lead-free interconnection materials in elect..:

Zhong, Su-juan ; Zhang, Liang ; Li, Mu-lan..
Materials & Design. 215 (2022) - p. 110439 , 2022

Link: https://doi.org/10.1016/..

13

Unexpected low thermal expansion coefficients of pentadiamo..:

Liao, Mingqing ; Wang, Yi ; Wang, Fengjiang..
Physical Chemistry Chemical Physics. 24 (2022) 38 - p. 23561-23569 , 2022

Link: https://doi.org/10.1039/..

14

Texture evolution and properties analysis of R60702 pure zi..:

Li, Taotao ; Li, Ruifeng ; Chang, Tao..
Materials Characterization. 182 (2021) - p. 111581 , 2021

Link: https://doi.org/10.1016/..

15

Microstructural Coarsening and Mechanical Properties of Eut..:

Wang, Fengjiang ; Luktuke, Amey ; Chawla, Nikhilesh
Journal of Electronic Materials. 50 (2021) 12 - p. 6607-6614 , 2021

Link: https://doi.org/10.1007/..