Wang, Wengan
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5

Bonding Below 150°C Using Nano-Ag Film for Power Electronic..:

Deng, Zhongyang ; Zou, Guisheng ; Zhang, Hongqiang...
Journal of Electronic Materials.  52 (2023)  6 - p. 3903-3913 , 2023
 
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7

The Mechanisms of Oxygen Accelerated Low‐Temperature Bondin..:

Wang, Wengan ; Zou, Guisheng ; Chen, Na...
Particle & Particle Systems Characterization.  40 (2023)  7 - p. , 2023
 
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10

Temperature dependence of the tensile and thermal fatigue c..:

Wu, Ying ; Zou, Guisheng ; Liu, Yan...
Materials Science and Engineering: A.  858 (2022)  - p. 144135 , 2022
 
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12

Thermal stress reduction strategy for high-temperature powe..:

Ren, Hui ; Zou, Guisheng ; Jia, Qiang...
Microelectronics Reliability.  127 (2021)  - p. 114379 , 2021
 
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14

Femtosecond Laser Irradiation-Mediated MoS2–Metal Contact E..:

Huo, Jinpeng ; Xiao, Yu ; Sun, Tianming...
ACS Applied Materials & Interfaces.  13 (2021)  45 - p. 54246-54257 , 2021
 
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15

Nacre‐Inspired, Liquid Metal‐Based Ultrasensitive Electroni..:

Feng, Bin ; Jiang, Xin ; Zou, Guisheng...
Advanced Functional Materials.  31 (2021)  29 - p. 2102359 , 2021
 
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