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Wang, Yih
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1

A New High Density 3D Stackable Via RRAM for Computing-in-M..:

Sing, Siao-Ping ; Wang, Ya-Ching ; Lin, Wei-Hwa...
IEEE Transactions on Electron Devices.  71 (2024)  4 - p. 2399-2403 , 2024
Link: https://doi.org/10.1109/..
 
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2

Efficient Processing of MLPerf Mobile Workloads Using Digit..:

Sun, Xiaoyu ; Cao, Weidong ; Crafton, Brian...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  43 (2024)  4 - p. 1191-1205 , 2024
Link: https://doi.org/10.1109/..
 
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3

CMOS-Compatible Embedded Artificial Synaptic Device (eASD) ..:

Huang, Yao-Hung ; Yu, Hsin-Yuan ; Chih, Yue-Der...
IEEE Transactions on Electron Devices.  71 (2024)  2 - p. 1313-1319 , 2024
Link: https://doi.org/10.1109/..
 
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4

A New Ultra-Low Voltage Metal Fuse for High Density OTP App..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Wang, Li-Yu ; Chen, Kuan-Ju ; Yuh, Perng-Fei... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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5

High-Density Embedded 3-D Stackable Via RRAM in 16-nm FinFE..:

Huang, Yao-Hung ; Hsieh, Yu-Cheng ; Lin, Yu-Cheng...
IEEE Transactions on Electron Devices.  71 (2024)  6 - p. 3614-3619 , 2024
Link: https://doi.org/10.1109/..
 
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6

34.4 A 3nm, 32.5TOPS/W, 55.0TOPS/mm2 and 3.78Mb/mm2 Fully-D..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Fujiwara, Hidehiro ; Mori, Haruki ; Zhao, Wei-Chang... - p. 572-574 , 2024
Link: https://doi.org/10.1109/..
 
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7

Exploiting a variational auto-encoder to represent the evol..:

Chen, Yi-Chang ; Liang, Yu-Chiao ; Wu, Chien-Ming...
Environmental Research: Climate.  3 (2024)  2 - p. 025006 , 2024
Link: https://doi.org/10.1088/..
 
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8

15.9 A 16nm 16Mb Embedded STT-MRAM with a 20ns Write Time, ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lin, Ku-Feng ; Noguchi, Hiroki ; Shih, Yi-Chun... - p. 292-294 , 2024
Link: https://doi.org/10.1109/..
 
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9

15.3 A 3nm FinFET 4.3GHz 21.1Mb/mm2 Double-Pumping 1-Read a..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Haraguchi, Masaru ; Fujino, Yorinobu ; Yokoyama, Yoshisato... - p. 280-282 , 2024
Link: https://doi.org/10.1109/..
 
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10

15.7 A 32Mb RRAM in a 12nm FinFet Technology with a 0.0249μ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Huang, Yi-Cheng ; Liu, Shang-Hsuan ; Chen, Hsu-Shun... - p. 288-290 , 2024
Link: https://doi.org/10.1109/..
 
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11

Write-enhanced Single-ended 11T SRAM Enabling Single Bitcel..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
You, Wei-Xiang ; Wang, Cheng-Yin ; Wang, Yih.. - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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12

A Trip Down Memory Lane: Reflections on the progress in mem..:

Chang, Tsung-Yung Jonathan ; Hamzaoglu, Fatih ; Li, Yan...
IEEE Solid-State Circuits Magazine.  15 (2023)  3 - p. 53-61 , 2023
Link: https://doi.org/10.1109/..
 
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13

33.1 A 16nm 32Mb Embedded STT-MRAM with a 6ns Read-Access T..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Lee, Po-Hao ; Lee, Chia-Fu ; Shih, Yi-Chun... - p. 494-496 , 2023
Link: https://doi.org/10.1109/..
 
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14

High-Speed Embedded Memory for AI and High-Performance Comp..:

, In: 2023 International Electron Devices Meeting (IEDM),
Wang, Yih ; Chen, Yen-Huei ; Chih, Y.D.... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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15

Guest Editorial Introduction to the Special Issue on the 20..:

Hossain, Masum ; Raychowdhury, Arijit ; Mathew, Sanu K...
IEEE Journal of Solid-State Circuits.  58 (2023)  1 - p. 3-7 , 2023
Link: https://doi.org/10.1109/..
 
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