Watanabe, Takahito
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1

Scalable Advanced DBHi Chiplet Package Using Silicon Bridge..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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3

Involvement of the scalloped gene in morphogenesis of the w..:

Yamashita, Takahisa ; Ohde, Takahiro ; Nakamura, Taro...
Development, Growth & Differentiation.  65 (2023)  6 - p. 348-359 , 2023
 
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5

Super Fine Jet Underfill Dispense Technique for Robust Micr..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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6

Solder and Organic Adhesive Hybrid Bonding Technology with ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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7

Characterization of Non-Conductive Paste Materials (NCP) fo..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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14

A Nickel Complex Containing a Pyramidalized, Ambiphilic Pin..:

Watanabe, Takahito ; Kasai, Yumi ; Tobita, Hiromi
Chemistry – A European Journal.  25 (2019)  59 - p. 13491-13495 , 2019
 
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