E-LIB Suche - Ergebnisse für: Wei, Debao

1

EBDN: Entropy-Based Double Nonuniform Sensing Algorithm for..:

Wang, Yongchao ; Wei, Debao ; Liu, Ming..
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 43 (2024) 6 - p. 1914-1918 , 2024

Link: https://doi.org/10.1109/..

2

Exploiting Feature Layer for Read Reference Voltage Optimiz..:

Wei, Debao ; Piao, Zhelong ; Liu, Ming...
IEEE Transactions on Consumer Electronics. 70 (2024) 1 - p. 433-444 , 2024

Link: https://doi.org/10.1109/..

3

Random Flip Bit Aware Reading for Improving High-Density 3-..:

Feng, Hua ; Wei, Debao ; Gu, Shipeng...
IEEE Transactions on Circuits and Systems I: Regular Papers. 71 (2024) 5 - p. 2372-2383 , 2024

Link: https://doi.org/10.1109/..

4

Lightweight Read Reference Voltage Calibration Strategy for..:

Feng, Hua ; Wei, Debao ; Wang, Yongchao...
IEEE Transactions on Device and Materials Reliability. 23 (2023) 3 - p. 370-379 , 2023

Link: https://doi.org/10.1109/..

5

Edge Word-Line Reliability Problem in 3-D NAND Flash Memory..:

Wei, Debao ; Feng, Hua ; Liu, Ming...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 31 (2023) 6 - p. 861-873 , 2023

Link: https://doi.org/10.1109/..

6

Neural Network Based Threshold Voltage Model for 3D TLC NAN..:

, In: 2023 IEEE 16th International Conference on Electronic Measurement & Instruments (ICEMI),

Wei, Debao ; Qu, Jingyuan ; Song, Yu.. - p. 125-132 , 2023

Link: https://doi.org/10.1109/..

7

Experimental Verification and Analysis of the Acceleration ..:

Wei, Debao ; Feng, Hua ; Qiao, Liyan..
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 41 (2022) 10 - p. 3543-3547 , 2022

Link: https://doi.org/10.1109/..

8

Design of Strain Signal Data Acquisition System for Wind Tu..:

, In: 2021 IEEE International Instrumentation and Measurement Technology Conference (I2MTC),

Liu, Wang ; Liu, Jianxin ; wei, Debao. - p. 1-6 , 2021

Link: https://doi.org/10.1109/..

9

A high-efficiency threshold voltage distribution test metho..:

Wei, Debao ; Chen, Xiaoyu ; Feng, Hua..
Microelectronics Reliability. 114 (2020) - p. 113897 , 2020

Link: https://doi.org/10.1016/..

10

FPGA-based reliability testing and analysis for 3D NAND fla..:

Wei, Debao ; Piao, Zhelong ; Feng, Hua..
Microelectronics Reliability. 114 (2020) - p. 113846 , 2020

Link: https://doi.org/10.1016/..

11

Research on 3D TLC NAND flash reliability from the perspect..:

Wei, Debao ; Feng, Hua ; Chen, Xiaoyu..
Microelectronics Reliability. 114 (2020) - p. 113738 , 2020

Link: https://doi.org/10.1016/..

12

Prediction models of bit errors for NAND flash memory using..:

Wei, Debao ; Qiao, Liyan ; Chen, Xiaoyu..
Review of Scientific Instruments. 90 (2019) 6 - p. , 2019

Link: https://doi.org/10.1063/..

13

A Hardware-Software Co-Design Real-Time Electric Simulative..:

Wei, Debao ; Dou, Tianwei ; Liu, Tong..
IEEE Access. 7 (2019) - p. 94332-94341 , 2019

Link: https://doi.org/10.1109/..

14

Reliability prediction model of NAND flash memory based on ..:

Wei, Debao ; Qiao, Liyan ; Hao, Mengqi..
Microelectronics Reliability. 100-101 (2019) - p. 113371 , 2019

Link: https://doi.org/10.1016/..

15

SREA: A self-recovery effect aware wear-leveling strategy f..:

Wei, Debao ; Qiao, Liyan ; Chen, Xiaoyu..
Microelectronics Reliability. 100-101 (2019) - p. 113433 , 2019

Link: https://doi.org/10.1016/..