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2024 Conference of Science and Technology for Integrated Circuits (CSTIC) ,
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Study on Failure Mechanism of C4 Bump Solder Excursion in C..:
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Organic Thermal Interface Materials Delamination Analysis o..:
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Research on the Functional Failure of Large Scale Chips Cau..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
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